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MCT8316A1VRGFR

Texas Instruments

MCT8316A1VRGFR by Texas Instruments

MCT8316A1VRGFR by Texas Instruments is a Motion Control IC with 24V nominal voltage, 8A max output current, and 40 terminals in a rectangular chip carrier package. It is used as a Brushless DC Motor Controller for applications requiring precise motion control at temperatures ranging from -40 to 125°C.

Median Price

$4.620

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,101 parts In-Stock

1+ parts

$2.913

100+ parts

$2.552

1k+ parts

$1.442

10k+ parts

-

5,101

$2.913

$2.552

$1.442

-

DigiKey

USA . 4,857 parts In-Stock

1+ parts

$4.620

100+ parts

$2.926

1k+ parts

$2.621

10k+ parts

$2.532

4,857

$4.620

$2.926

$2.621

$2.532

Mouser Electronics

USA . 1,944 parts In-Stock

1+ parts

$4.620

100+ parts

$2.930

1k+ parts

$2.630

10k+ parts

$2.530

1,944

$4.620

$2.930

$2.630

$2.530

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,008 parts In-Stock

1+ parts

$1.800

100+ parts

-

1k+ parts

-

10k+ parts

-

2,008

$1.800

-

-

-

Digiode

USA . 4,723 parts In-Stock

1+ parts

$2.767

100+ parts

-

1k+ parts

-

10k+ parts

-

4,723

$2.767

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,898 parts In-Stock

1+ parts

$1.530

100+ parts

$1.492

1k+ parts

$1.484

10k+ parts

-

2,898

$1.530

$1.492

$1.484

-

Ampacity Inc.

Singapore . 2,653 parts In-Stock

1+ parts

$1.530

100+ parts

-

1k+ parts

-

10k+ parts

-

2,653

$1.530

-

-

-

Corohmni

South Africa . 206 parts In-Stock

1+ parts

$1.800

100+ parts

-

1k+ parts

-

10k+ parts

-

206

$1.800

-

-

-

Corphita

USA . 1,890 parts In-Stock

1+ parts

$2.622

100+ parts

-

1k+ parts

-

10k+ parts

-

1,890

$2.622

-

-

-

Parana Technologies

USA . 1,434 parts In-Stock

1+ parts

$9.816

100+ parts

-

1k+ parts

$10.386

10k+ parts

-

1,434

$9.816

-

$10.386

-

IDEA Electronic Components Group

UK . 1,986 parts In-Stock

1+ parts

$11.029

100+ parts

$10.478

1k+ parts

$9.926

10k+ parts

-

1,986

$11.029

$10.478

$9.926

-

ChromeModa Solutions

Germany . 549 parts In-Stock

1+ parts

$11.029

100+ parts

$9.044

1k+ parts

-

10k+ parts

-

549

$11.029

$9.044

-

-

DigiPath Technology Company

USA . 1,742 parts In-Stock

1+ parts

-

100+ parts

$9.944

1k+ parts

-

10k+ parts

-

1,742

-

$9.944

-

-

Overview

Experience the seamless precision and reliability of the MCT8316A1VRGFR by Texas Instruments, a top-tier manufacturer renowned for its cutting-edge technology. As part of the Motion Control ICs category, this chip carrier with a very thin profile offers unparalleled performance in applications such as brushless DC motor controllers. With a wide supply voltage range, high output current capacity, and excellent thermal properties, this product ensures optimal functionality and efficiency in various industrial and consumer electronics projects. Trust Texas Instruments to deliver superior quality and innovation with every component they produce.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to external elements, ensuring the product's longevity and reliability.

Surface Mount: YES

Facilitates easy installation and mounting on circuit boards, simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 24 V

Suitable for a wide range of applications and provides stable power for optimal performance.

No. of Terminals: 40

Offers a high level of connectivity options and flexibility in connecting to other components.

Maximum Operating Temperature: 125 °C

Ensures the IC can operate in a wide range of environmental conditions without risk of overheating.

Minimum Operating Temperature: -40 °C

Allows the IC to function in cold environments, expanding its usability in various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and excellent electrical conductivity for reliable connections.

Width (mm): 5 mm

Compact size enables the IC to be integrated into space-constrained designs without sacrificing functionality.

Minimum Supply Voltage (Vsup): 4.5 V

Allows the IC to operate even with low input voltages, making it versatile for use in different systems.

Maximum Output Current: 8 A

Capable of delivering high current output for driving motors or other power-consuming devices effectively.

Technical Specifications

Motion Control ICs MCT8316A1VRGFR attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PQCC-N40

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2X.27,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

30 mA

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

5 mm

Trade Compliance

MCT8316A1VRGFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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