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MAX3243IDWRG4

Texas Instruments

MAX3243IDWRG4 by Texas Instruments

MAX3243IDWRG4 by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 3.6V max supply voltage. It features inverted output polarity, Schmitt trigger input characteristics, and CMOS technology. Ideal for EIA-232-F, TIA-232-F, V.28 interface standards in industrial temperature grades applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,176 parts In-Stock

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Digiode

USA . 2,010 parts In-Stock

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2,010

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Distributors (Availability)

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One Stop Electronics

USA . 833 parts In-Stock

1+ parts

$0.500

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833

$0.500

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Parana Technologies

USA . 638 parts In-Stock

1+ parts

$4.718

100+ parts

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$5.211

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638

$4.718

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$5.211

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ChromeModa Solutions

Germany . 5,304 parts In-Stock

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$5.301

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$4.347

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$5.301

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IDEA Electronic Components Group

UK . 436 parts In-Stock

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$5.301

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$4.771

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436

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$4.771

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AZTECH Wire

Italy . 455 parts In-Stock

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$12.358

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455

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Corphita

USA . 3,619 parts In-Stock

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Microchip USA

USA . 1,719 parts In-Stock

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DigiPath Technology Company

USA . 1,353 parts In-Stock

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$4.779

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Overview

Experience unparalleled reliability and performance with the MAX3243IDWRG4 by Texas Instruments. As a trusted industry leader, Texas Instruments delivers exceptional quality in every product they create. Designed for Line Drivers & Receivers applications, this small outline package offers customers a compact solution with inverted output polarity and Schmitt trigger input characteristics. With a wide temperature range and maximum supply voltage of 3.6V, the MAX3243IDWRG4 ensures optimal functionality in industrial settings. Trust Texas Instruments to provide cutting-edge technology that meets your needs for efficiency and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for long-term use.

Surface Mount: YES

Allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 3.6 V

Offers flexibility in power supply options.

No. of Functions: 3

Provides multiple functions in a single product for efficiency.

Package Shape: RECTANGULAR

Enables easy integration into existing systems.

Maximum Transmit Delay: 150 ns

Ensures quick transmission of data signals.

Power Supplies (V): 3.3/5

Compatibility with different power supply voltages.

No. of Terminals: 28

Sufficient terminals for connection to other components.

Package Style (Meter): SMALL OUTLINE

Compact design for efficient use of space.

Minimum Supply Voltage: 3 V

Works with lower power supply voltages for energy efficiency.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Operational in extreme low-temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and ensures reliable connections.

Maximum Output Low Current: 1.6 Amp

Capable of driving high-current loads.

Output Polarity: INVERTED

Suitable for applications where inverted output signals are required.

Receiver No. of Bits: 5

Supports data transmission with high bit resolution.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial settings.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Facilitates easy soldering onto PCBs.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compliant with industry standards for seamless integration.

Maximum Supply Current: 1 mA

Low power consumption for energy-efficient operation.

Technical Specifications

Line Drivers & Receivers MAX3243IDWRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

CAN ALSO OPERATE WITH 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

5 V

Maximum Output Low Current:

1.6 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

150 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

150 ns

Width:

7.5 mm

Trade Compliance

MAX3243IDWRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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