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MAX3243CPWRE4

Texas Instruments

MAX3243CPWRE4 by Texas Instruments

MAX3243CPWRE4 by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 3.6V max supply voltage. It has a transmit delay of 150ns and operates in commercial temperature grade. Ideal for EIA-232-F, TIA-232-F, V.28 interface standards in various applications requiring reliable communication.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,107 parts In-Stock

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7,107

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Digiode

USA . 2,079 parts In-Stock

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2,079

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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One Stop Electronics

USA . 372 parts In-Stock

1+ parts

$3.500

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372

$3.500

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Corohmni

South Africa . 158 parts In-Stock

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$4.919

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158

$4.919

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Parana Technologies

USA . 1,887 parts In-Stock

1+ parts

$5.255

100+ parts

$488.048

1k+ parts

$4.730

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1,887

$5.255

$488.048

$4.730

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DigiPath Technology Company

USA . 990 parts In-Stock

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$5.787

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990

$5.787

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ChromeModa Solutions

Germany . 5,239 parts In-Stock

1+ parts

$5.905

100+ parts

$4.842

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5,239

$5.905

$4.842

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IDEA Electronic Components Group

UK . 1,358 parts In-Stock

1+ parts

$5.905

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$5.314

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1,358

$5.905

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$5.314

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AZTECH Wire

Italy . 262 parts In-Stock

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$16.813

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262

$16.813

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Ampacity Inc.

Singapore . 1,215 parts In-Stock

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$24.500

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$24.500

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Component Stockers USA

USA . 427 parts In-Stock

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$99.990

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427

$99.990

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Argo Parts USA

USA . 5,203 parts In-Stock

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Microchip USA

USA . 4,900 parts In-Stock

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Corphita

USA . 4,493 parts In-Stock

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Continental Prestige Electronics

USA . 1,189 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Assy Fe

Spain . 6 parts In-Stock

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6

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Overview

Experience seamless communication with the MAX3243CPWRE4 by Texas Instruments. Crafted with precision using high-quality materials, this line driver & receiver offers unparalleled performance and reliability. Ideal for a wide range of applications, this product ensures smooth data transmission with minimal delay, making it a valuable addition to any project. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your communication systems with the MAX3243CPWRE4 and experience unmatched quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of input voltages, providing flexibility in different operating conditions.

No. of Functions: 3

Having multiple functions in a single device simplifies circuit design and reduces component count, leading to cost savings and improved reliability.

Maximum Transmit Delay: 150 ns

The low transmit delay ensures fast signal transmission, making this product suitable for high-speed communication applications.

Power Supplies (V): 3.3/5

Compatibility with multiple power supply voltages offers versatility in system integration and operation.

No. of Terminals: 28

Having a high number of terminals allows for connectivity to multiple external components, expanding the versatility and functionality of the product.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can operate effectively in cold environments without performance degradation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Line Drivers & Receivers MAX3243CPWRE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

CAN ALSO OPERATE WITH 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

5 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

150 ns

Receiver No. of Bits:

5

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

150 ns

Width:

4.4 mm

Trade Compliance

MAX3243CPWRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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