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MAX3238ECDB

Texas Instruments

MAX3238ECDB by Texas Instruments

MAX3238ECDB by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 3.6V. It has a transmit delay of 150ns and supports EIA-232-F, TIA-232-F, V.28 interfaces. Ideal for applications requiring inverted output polarity and Schmitt trigger input characteristics in commercial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,874 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,874

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Digiode

USA . 2,431 parts In-Stock

1+ parts

-

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2,431

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,517 parts In-Stock

1+ parts

$3.309

100+ parts

-

1k+ parts

$3.832

10k+ parts

-

1,517

$3.309

-

$3.832

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DigiPath Technology Company

USA . 748 parts In-Stock

1+ parts

$3.644

100+ parts

-

1k+ parts

-

10k+ parts

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748

$3.644

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ChromeModa Solutions

Germany . 5,448 parts In-Stock

1+ parts

$3.718

100+ parts

$3.049

1k+ parts

-

10k+ parts

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5,448

$3.718

$3.049

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IDEA Electronic Components Group

UK . 371 parts In-Stock

1+ parts

$3.718

100+ parts

-

1k+ parts

$3.346

10k+ parts

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371

$3.718

-

$3.346

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Microchip USA

USA . 2,939 parts In-Stock

1+ parts

$14.913

100+ parts

-

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2,939

$14.913

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One Stop Electronics

USA . 310 parts In-Stock

1+ parts

$15.500

100+ parts

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310

$15.500

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AZTECH Wire

Italy . 385 parts In-Stock

1+ parts

$17.555

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385

$17.555

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Kepictronics

USA . 2,900 parts In-Stock

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2,900

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Corphita

USA . 2,483 parts In-Stock

1+ parts

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2,483

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Overview

Enhance your communication systems with the MAX3238ECDB by Texas Instruments, a top-of-the-line line driver and receiver designed to deliver exceptional performance and reliability. Manufactured by industry leader Texas Instruments, this versatile component offers seamless integration and maximum efficiency in a variety of applications. Unlock unparalleled value and benefits for your projects with the MAX3238ECDB, providing superior quality, precision, and functionality that will elevate your system's performance to new heights. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making the product reliable for various applications.

Maximum Supply Voltage: 3.6 V

Supports a maximum supply voltage of 3.6V, allowing for compatibility with a wide range of power sources.

Maximum Transmit Delay: 150 ns

Low transmit delay of 150 ns ensures efficient data transmission and communication speed.

Output Polarity: INVERTED

Inverted output polarity provides flexibility in signal processing and compatibility with various systems.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compliance with industry-standard interface protocols ensures seamless integration with existing systems and devices.

Technical Specifications

Line Drivers & Receivers MAX3238ECDB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

5

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

.001 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

150 ns

Receiver No. of Bits:

3

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

150 ns

Width:

5.3 mm

Trade Compliance

MAX3238ECDB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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