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MAX3232CDWG4

Texas Instruments

MAX3232CDWG4 by Texas Instruments

MAX3232CDWG4 by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at 3.3/5V. It features inverted output polarity, Schmitt trigger input characteristics, and EIA-232-F interface standard. Ideal for applications requiring fast transmit/receive speeds in commercial temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 18,010 parts In-Stock

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Vyrian

USA . 7,747 parts In-Stock

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Digiode

USA . 1,248 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Distributors (Availability)

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Vigor

Singapore . 6,743 parts In-Stock

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$1.340

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$1.340

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Parana Technologies

USA . 568 parts In-Stock

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$3.885

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$4.364

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568

$3.885

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$4.364

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ChromeModa Solutions

Germany . 6,294 parts In-Stock

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$4.365

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$3.579

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$4.365

$3.579

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IDEA Electronic Components Group

UK . 2,244 parts In-Stock

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$4.365

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$3.928

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One Stop Electronics

USA . 644 parts In-Stock

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$7.500

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$7.500

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Corohmni

South Africa . 585 parts In-Stock

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$14.674

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AZTECH Wire

Italy . 192 parts In-Stock

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$18.916

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Ampacity Inc.

Singapore . 794 parts In-Stock

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$40.500

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Semicontronic

India . 1,026 parts In-Stock

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$47.500

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$46.312

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$46.075

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Argo Parts USA

USA . 3,736 parts In-Stock

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Microchip USA

USA . 1,556 parts In-Stock

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Eliminating Global Boundries, Inc

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Corphita

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DigiPath Technology Company

USA . 54 parts In-Stock

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$3.935

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Bastille Electronics

Australia . 43 parts In-Stock

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Perfect Parts

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Continental Prestige Electronics

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Overview

Enhance your electronic designs with the MAX3232CDWG4 by Texas Instruments, a leading manufacturer known for top-quality components. This versatile Line Driver & Receiver is perfect for applications requiring reliable signal transmission, offering unmatched value and performance. With its compact package design, wide operating temperature range, and low power consumption, this product provides customers with the advantages they need to bring their projects to the next level. Trust Texas Instruments to deliver excellence in every aspect of your electronics needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards, saving space and facilitating automated assembly.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage of 3.6V, this product can handle a wide range of power inputs, increasing versatility and compatibility.

No. of Functions: 2

Having multiple functions in one device reduces the need for additional components, simplifying the circuit design and reducing overall costs.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on circuit boards, optimizing space utilization and enabling compact designs.

Maximum Transmit Delay: 300 ns

The low maximum transmit delay ensures fast signal transmission, making this product suitable for high-speed data communication applications.

Power Supplies (V): 3.3/5

Supporting power supplies of 3.3V and 5V allows for compatibility with a wide range of systems, enhancing flexibility in design and integration.

No. of Terminals: 16

Having 16 terminals provides ample connection points for interfacing with other components, enabling versatile configurations and functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices and applications with limited board real estate.

Minimum Supply Voltage-1: 3 V

With a low minimum supply voltage of 3V, this product can operate efficiently even in power-constrained environments, ensuring reliable performance.

Maximum High Level Input Current: 0.000001 Amp

The low maximum high level input current minimizes power consumption, making the product energy-efficient and suitable for battery-powered devices.

Minimum Operating Temperature: 0 °C

The wide operating temperature range from 0°C ensures reliable performance in diverse environmental conditions, enhancing the product's versatility and durability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring long-term reliability and performance.

Maximum Output Low Current: 1.6 Amp

With a high maximum output low current rating of 1.6A, this product can drive demanding loads with ease, making it suitable for power-hungry applications.

Output Polarity: INVERTED

The inverted output polarity simplifies signal processing and interfacing with other devices, enhancing compatibility and ease of integration.

Receiver No. of Bits: 2

Having 2 receiver bits allows for precise data reception and decoding, ensuring accurate communication and data integrity in the system.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables reliable soldering during assembly processes, ensuring strong connections and robust performance.

Minimum Out Swing: 10 V

The minimum output swing of 10V provides a wide voltage range for signal transmission, making this product suitable for various signal levels and applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation within standard temperature ranges, making the product suitable for commercial applications.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input characteristics provide hysteresis and noise immunity, enhancing signal integrity and robustness in noisy environments.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures consistent and stable power delivery, promoting reliable operation and performance of the product.

Driver No. of Bits: 2

Having 2 driver bits allows for precise signal generation and transmission, ensuring accurate and efficient communication in the system.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type enables bidirectional communication between different systems or devices, facilitating versatile and reliable data exchange.

Technical Specifications

Line Drivers & Receivers MAX3232CDWG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

CAN ALSO OPERATE WITH 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

300 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

300 ns

Width:

7.5 mm

Trade Compliance

MAX3232CDWG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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