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MAX3222ECDB

Texas Instruments

MAX3222ECDB by Texas Instruments

MAX3222ECDB by Texas Instruments is a Line Driver & Receiver with 20 terminals, operating at 3.3/5V. It features inverted output polarity, Schmitt trigger input characteristics, and EIA-232-F interface standard. Ideal for applications requiring fast transmit/receive delays and low power consumption in commercial temperature range.

Median Price

$1.768

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 201 parts In-Stock

1+ parts

$2.700

100+ parts

$1.980

1k+ parts

$1.920

10k+ parts

$1.490

201

$2.700

$1.980

$1.920

$1.490

Rochester

USA . 7,733 parts In-Stock

1+ parts

-

100+ parts

$1.450

1k+ parts

$1.300

10k+ parts

$1.220

7,733

-

$1.450

$1.300

$1.220

DigiKey

USA . 7,733 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.910

10k+ parts

-

7,733

-

-

$1.910

-

Verical

USA . 6,133 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.625

10k+ parts

$1.525

6,133

-

-

$1.625

$1.525

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,465 parts In-Stock

1+ parts

$1.330

100+ parts

-

1k+ parts

-

10k+ parts

-

2,465

$1.330

-

-

-

DigiKey Marketplace

USA . 7,733 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,733

-

-

-

-

Vyrian

USA . 4,310 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,310

-

-

-

-

Bristol Electronics

USA . 1,655 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,655

-

-

-

-

Prism Electronics

USA . 102 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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102

-

-

-

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Elcom Components

USA . 45 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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45

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,088 parts In-Stock

1+ parts

$1.260

100+ parts

-

1k+ parts

-

10k+ parts

-

2,088

$1.260

-

-

-

Component Stockers USA

USA . 6,253 parts In-Stock

1+ parts

$1.420

100+ parts

$1.330

1k+ parts

$1.210

10k+ parts

-

6,253

$1.420

$1.330

$1.210

-

Parana Technologies

USA . 299 parts In-Stock

1+ parts

$6.397

100+ parts

-

1k+ parts

$7.147

10k+ parts

-

299

$6.397

-

$7.147

-

DigiPath Technology Company

USA . 1,720 parts In-Stock

1+ parts

$7.044

100+ parts

-

1k+ parts

-

10k+ parts

-

1,720

$7.044

-

-

-

ChromeModa Solutions

Germany . 1,472 parts In-Stock

1+ parts

$7.188

100+ parts

$5.894

1k+ parts

-

10k+ parts

-

1,472

$7.188

$5.894

-

-

IDEA Electronic Components Group

UK . 546 parts In-Stock

1+ parts

$7.188

100+ parts

-

1k+ parts

$6.469

10k+ parts

-

546

$7.188

-

$6.469

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,000

-

-

-

-

Perfect Parts

USA . 655 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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655

-

-

-

-

Overview

Upgrade your communication systems with the MAX3222ECDB by Texas Instruments, a top-of-the-line Line Driver & Receiver. Crafted with precision and quality in mind, this product offers unparalleled reliability and performance. Ideal for a wide range of applications, this compact device provides a seamless interface standard with EIA-232-F, TIA-232-F, and V.28. With minimal power requirements and maximum supply voltage of 3.6V, the MAX3222ECDB ensures efficient operation and superior results. Elevate your projects with this innovative solution from a trusted manufacturer like Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides a lightweight and durable construction for the product.

Surface Mount: YES

Allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 3.6 V

Can handle a relatively high supply voltage for reliable operation.

No. of Functions: 2

Provides flexibility and versatility in its functionality.

Package Shape: RECTANGULAR

Simplifies component placement and integration in circuit designs.

Maximum Transmit Delay: 300 ns

Ensures fast transmission speeds for real-time data processing.

Power Supplies (V): 3.3/5

Supports multiple power supply options for compatibility with different systems.

No. of Terminals: 20

Offers ample connection points for input and output signals.

Minimum Operating Temperature: 0 °C

Suitable for use in a wide range of temperature environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity and corrosion resistance for reliable performance.

Technical Specifications

Line Drivers & Receivers MAX3222ECDB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

.001 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

300 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

300 ns

Width:

5.3 mm

Trade Compliance

MAX3222ECDB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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