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MAX3221IDB

Texas Instruments

MAX3221IDB by Texas Instruments

MAX3221IDB by Texas Instruments is a line driver/receiver with 16 terminals, operating at 3.3/5V. It features inverted output polarity, CMOS technology, and EIA-232-F interface standard. Ideal for industrial applications requiring a supply voltage of 3-5V and peak reflow temperature of 260°C.

Median Price

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Lifecycle Status

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13

In-Stock Inventory

1k+

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Chip Stock

USA . 11,500 parts In-Stock

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Vyrian

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Digiode

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Bristol Electronics

USA . 1,109 parts In-Stock

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Atlantic Semiconductor

USA . 187 parts In-Stock

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ComSIT Distribution GmbH

Germany . 148 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 140 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 75 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 54 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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South Electronics

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Prism Electronics

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Vigor

Singapore . 1,212 parts In-Stock

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$1.910

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Corohmni

South Africa . 212 parts In-Stock

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$2.495

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Ampacity Inc.

Singapore . 824 parts In-Stock

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$3.500

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AZTECH Wire

Italy . 566 parts In-Stock

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$10.724

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Parana Technologies

USA . 336 parts In-Stock

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$13.148

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$13.655

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ChromeModa Solutions

Germany . 4,317 parts In-Stock

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IDEA Electronic Components Group

UK . 683 parts In-Stock

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$14.034

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One Stop Electronics

USA . 759 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Continental Prestige Electronics

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Argo Parts USA

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Microchip USA

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DigiPath Technology Company

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Corphita

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Kepictronics

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Metaverse IC Inc.

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Cyclops Electronics Ltd (Excess)

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Bastille Electronics

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Speed Components Ltd (Excess)

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Computer Components Inc. - USA

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GreenTree Electronics

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Overview

Unlock seamless communication with the MAX3221IDB by Texas Instruments, a top-of-the-line line driver and receiver that ensures reliable data transmission. Crafted with precision by Texas Instruments, this product guarantees superior quality and performance. Perfect for a wide range of applications, this versatile device offers unmatched value and benefits to customers looking for a seamless communication solution. Upgrade your systems today with the MAX3221IDB and experience the difference in efficiency and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the line driver and receiver, ensuring long-term reliability.

Surface Mount: YES

The surface mount option allows for easy integration onto circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.6 V

The 3.6 V maximum supply voltage allows for compatibility with a wide range of power sources, providing flexibility in various applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the line driver and receiver can function effectively in environments with elevated temperatures, making it suitable for industrial use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to remain operational even in extremely cold conditions, increasing its versatility in different environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the line driver and receiver efficient and reliable in signal transmission.

Technical Specifications

Line Drivers & Receivers MAX3221IDB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATE WITH 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

1

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

150 ns

Receiver No. of Bits:

1

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

MAX3221IDB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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