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MAX232DWRE4

Texas Instruments

MAX232DWRE4 by Texas Instruments

MAX232DWRE4 by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 5V. It features totem-pole output characteristics and inverted polarity, suitable for EIA-232-F, TIA-232-F, V.28 interfaces. With a small outline package style and Schmitt trigger input characteristics, it is ideal for commercial temperature grade applications requiring reliable data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,894 parts In-Stock

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8,894

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Digiode

USA . 1,512 parts In-Stock

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1,512

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 655 parts In-Stock

1+ parts

$4.490

100+ parts

-

1k+ parts

$4.928

10k+ parts

-

655

$4.490

-

$4.928

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DigiPath Technology Company

USA . 308 parts In-Stock

1+ parts

$4.944

100+ parts

$4.549

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-

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308

$4.944

$4.549

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IDEA Electronic Components Group

UK . 1,640 parts In-Stock

1+ parts

$5.045

100+ parts

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$4.540

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1,640

$5.045

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$4.540

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ChromeModa Solutions

Germany . 274 parts In-Stock

1+ parts

$5.045

100+ parts

$4.137

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274

$5.045

$4.137

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Corohmni

South Africa . 522 parts In-Stock

1+ parts

$5.260

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522

$5.260

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Ampacity Inc.

Singapore . 441 parts In-Stock

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$8.500

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441

$8.500

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AZTECH Wire

Italy . 492 parts In-Stock

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$9.900

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492

$9.900

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One Stop Electronics

USA . 1,574 parts In-Stock

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$45.500

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$45.500

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Semicontronic

India . 389 parts In-Stock

1+ parts

$45.500

100+ parts

$44.362

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$44.135

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389

$45.500

$44.362

$44.135

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iodParts Technologies Inc.

India . 9,460 parts In-Stock

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Argo Parts USA

USA . 3,990 parts In-Stock

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Corphita

USA . 3,950 parts In-Stock

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Microchip USA

USA . 2,375 parts In-Stock

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Continental Prestige Electronics

USA . 2,341 parts In-Stock

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Advanced Electronics

New Zealand . 41 parts In-Stock

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41

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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Overview

Enhance your electronics projects with the MAX232DWRE4 from Texas Instruments, a trusted manufacturer known for top-notch quality. This line driver and receiver offers seamless communication between devices, making it ideal for a wide range of applications. With its innovative design and reliable performance, this product provides exceptional value and benefits to customers, ensuring smooth operation and connectivity in any project. Trust Texas Instruments and the MAX232DWRE4 to elevate your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the product, making it suitable for various environmental conditions.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

Ensures compatibility with a wide range of power sources, providing flexibility in usage.

No. of Functions: 2

Having multiple functions in a single device can help in reducing the overall component count in a design, saving space and cost.

Package Shape: RECTANGULAR

The rectangular shape is standard and can easily fit into existing electronic systems or designs.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of electronic devices and systems.

Maximum Operating Temperature: 70 °C

The ability to operate at high temperatures ensures reliability and functionality in various operating environments.

Output Characteristics: TOTEM-POLE

Totem-pole output provides strong, high-current drive capability, making it suitable for driving various loads.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger inputs provide noise immunity and signal conditioning, improving the overall performance and reliability of the product.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compliance with industry standards ensures compatibility and interoperability with a wide range of communication systems.

Technical Specifications

Line Drivers & Receivers MAX232DWRE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

EXTERNAL CHARGE PUMP

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

3.2 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

MAX232DWRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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