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LT1009MKGD1

Texas Instruments

LT1009MKGD1 by Texas Instruments

LT1009MKGD1 by Texas Instruments is a 2-terminal voltage reference with output voltage of 2.5V, ±1.5% tolerance, and 35 ppm/°C temperature coefficient. Ideal for military-grade applications requiring precise voltage regulation in a compact rectangular chip package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,719 parts In-Stock

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8,719

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Digiode

USA . 2,867 parts In-Stock

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2,867

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Distributors (Availability)

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One Stop Electronics

USA . 537 parts In-Stock

1+ parts

$3.500

100+ parts

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537

$3.500

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Ampacity Inc.

Singapore . 386 parts In-Stock

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$4.500

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386

$4.500

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AZTECH Wire

Italy . 594 parts In-Stock

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$6.677

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594

$6.677

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Parana Technologies

USA . 2,148 parts In-Stock

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$7.396

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$7.887

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2,148

$7.396

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$7.887

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Semicontronic

India . 1,534 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

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$7.275

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1,534

$7.500

$7.312

$7.275

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DigiPath Technology Company

USA . 622 parts In-Stock

1+ parts

$8.144

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622

$8.144

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IDEA Electronic Components Group

UK . 949 parts In-Stock

1+ parts

$8.310

100+ parts

$7.894

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$7.479

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949

$8.310

$7.894

$7.479

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ChromeModa Solutions

Germany . 546 parts In-Stock

1+ parts

$8.310

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$6.814

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546

$8.310

$6.814

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Microchip USA

USA . 3,998 parts In-Stock

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Corphita

USA . 3,235 parts In-Stock

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Corohmni

South Africa . 54 parts In-Stock

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Overview

Experience reliability and precision with the LT1009MKGD1 by Texas Instruments, a leading manufacturer in voltage references. This innovative product offers unmatched quality and accuracy for a wide range of applications. With its trimmable output and temperature stability, this voltage reference ensures consistent performance even in demanding environments. Trust Texas Instruments to deliver superior products that provide value and peace of mind to customers looking for top-notch solutions in the electronics industry.

Feature Benefit Bullets

Surface Mount: YES

This allows for easy installation on a circuit board without the need for additional mounting hardware, making the product convenient and space-saving.

Trim or Adjustable Output (V): YES

The ability to adjust the output voltage provides flexibility in various applications where precise voltage levels are required.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient placement and alignment on the circuit board, making it easy to integrate into designs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this voltage reference can withstand potentially harsh environments, ensuring reliable performance.

Nominal Output Voltage: 2.5 V

The precise output voltage of 2.5V ensures consistent and accurate power supply requirements in electronic circuits, making it a reliable choice for voltage reference applications.

Technical Specifications

Voltage References LT1009MKGD1 attributes and parameters. Explore more Voltage References devices from Texas Instruments

Specs

JESD-30 Code:

R-XUUC-N12

Length:

1.336 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Voltage:

2.51 V

Minimum Output Voltage:

2.49 V

Nominal Output Voltage:

2.5 V

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Sub-Category:

Voltage References

Surface Mount:

YES

Technology:

BIPOLAR

Max Voltage Temp Coef:

35 ppm/Cel

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trim or Adjustable Output (V):

YES

Maximum Voltage Tolerance:

1.5 %

Width (mm):

1.24 mm

Trade Compliance

LT1009MKGD1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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