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LP5904TME-3.0/NOPB

Texas Instruments

LP5904TME-3.0/NOPB by Texas Instruments

Texas Instruments LP5904TME-3.0/NOPB is a fixed/adjustable positive single output LDO regulator in a square grid array package with 4 ball terminals for surface mount applications. It offers an output voltage of 3.0V, ideal for low-power circuits in various electronic devices requiring stable power supply.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,487 parts In-Stock

1+ parts

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2,487

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Anansix

USA . 2,135 parts In-Stock

1+ parts

-

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2,135

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Digiode

USA . 1,623 parts In-Stock

1+ parts

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1,623

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 348 parts In-Stock

1+ parts

$8.266

100+ parts

-

1k+ parts

-

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348

$8.266

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Parana Technologies

USA . 1,880 parts In-Stock

1+ parts

$8.589

100+ parts

-

1k+ parts

$9.253

10k+ parts

-

1,880

$8.589

-

$9.253

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DigiPath Technology Company

USA . 2,053 parts In-Stock

1+ parts

$9.458

100+ parts

$8.701

1k+ parts

-

10k+ parts

-

2,053

$9.458

$8.701

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ChromeModa Solutions

Germany . 5,307 parts In-Stock

1+ parts

$9.651

100+ parts

$7.914

1k+ parts

-

10k+ parts

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5,307

$9.651

$7.914

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IDEA Electronic Components Group

UK . 1,371 parts In-Stock

1+ parts

$9.651

100+ parts

$9.168

1k+ parts

$8.686

10k+ parts

-

1,371

$9.651

$9.168

$8.686

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One Stop Electronics

USA . 1,221 parts In-Stock

1+ parts

$23.500

100+ parts

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1,221

$23.500

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Corphita

USA . 4,973 parts In-Stock

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4,973

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Overview

Discover the LP5904TME-3.0/NOPB by Texas Instruments, a high-quality fixed and adjustable regulator that offers reliable power management solutions for a wide range of applications. With its durable plastic/epoxy package and surface mount capability, this LDO regulator provides efficient performance and precise voltage regulation. Trust in Texas Instruments' reputation for excellence in manufacturing to deliver a product that exceeds expectations. Experience the value and benefits of the LP5904TME-3.0/NOPB for your next project, whether it's in consumer electronics, industrial automation, or telecommunications. Upgrade to superior power management with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while keeping the weight of the device low.

Surface Mount: YES

Being surface-mountable allows for easy and efficient PCB assembly, saving time and cost during production.

Package Shape: SQUARE

The square shape helps in optimizing space on the PCB, making it suitable for compact designs and applications where space is limited.

Terminal Form: BALL

The ball terminals ensure reliable connections and minimize the risk of solder joint failure, enhancing the overall reliability of the product.

No. of Terminals: 4

Having 4 terminals provides flexibility in connecting the regulator to other components, allowing for versatile integration within different electronic systems.

Package Style (Meter): GRID ARRAY

The grid array package style offers increased thermal performance and better electrical characteristics, contributing to the overall efficiency and performance of the regulator.

Regulator Type: FIXED/ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

This type of regulator offers the flexibility of fixed or adjustable output voltage, catering to a wide range of voltage requirements in various electronic devices.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and routing, making it easier to design and assemble the product in electronic circuits.

Technical Specifications

Fixed & Adjustable Regulators - Positive Single Output LDO LP5904TME-3.0/NOPB attributes and parameters. Explore more Fixed & Adjustable Regulators - Positive Single Output LDO devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B4

No. of Terminals:

4

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

GRID ARRAY

Qualification Status:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

LP5904TME-3.0/NOPB Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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