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LP3879SDX-1.0

Texas Instruments

LP3879SDX-1.0 by Texas Instruments

LP3879SDX-1.0 by Texas Instruments is a fixed positive single output standard regulator with a nominal output voltage of 1V and max output current of 0.8A. Operating temperature ranges from -40 to 125°C, making it suitable for various applications requiring stable voltage regulation in compact spaces. Its small outline package style with very thin profile and surface mount capability enhance its versatility in electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,053 parts In-Stock

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Anansix

USA . 1,421 parts In-Stock

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Digiode

USA . 513 parts In-Stock

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513

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One Stop Electronics

USA . 1,340 parts In-Stock

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$1.500

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$1.500

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Parana Technologies

USA . 10 parts In-Stock

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$8.593

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$9.256

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10

$8.593

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$9.256

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DigiPath Technology Company

USA . 1,483 parts In-Stock

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$9.462

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$8.705

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1,483

$9.462

$8.705

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ChromeModa Solutions

Germany . 2,106 parts In-Stock

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$9.655

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$7.917

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2,106

$9.655

$7.917

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IDEA Electronic Components Group

UK . 2,017 parts In-Stock

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$9.655

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$9.172

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$8.690

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2,017

$9.655

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$8.690

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AZTECH Wire

Italy . 495 parts In-Stock

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$10.853

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495

$10.853

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Corphita

USA . 5,221 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,617 parts In-Stock

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Microchip USA

USA . 351 parts In-Stock

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Overview

Experience the pinnacle of quality and reliability with the LP3879SDX-1.0 by Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge technology that exceeds expectations. This fixed regulator offers stability and precision, making it ideal for a wide range of applications. With its compact design and efficient performance, the LP3879SDX-1.0 provides unparalleled value and benefits to customers looking for a reliable power solution. Trust in Texas Instruments to power your innovation with the LP3879SDX-1.0.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying assembly processes.

Operating Temperature (TJ-Max): 125 °C

With a high maximum operating temperature of 125°C, the product can withstand harsh environmental conditions without compromising performance.

Technology: BIPOLAR

The bipolar technology used in this product ensures stable and reliable voltage regulation, contributing to the overall efficiency and performance of the device.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easy integration into a variety of electronic devices or systems.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of environmental contamination and provides a more environmentally friendly solution.

Nominal Output Voltage-1: 1 V

The 1V nominal output voltage ensures a stable and consistent power supply, suitable for a wide range of applications.

Adjustability: FIXED

The fixed adjustability means that the output voltage is predetermined and cannot be changed, providing simplicity and reliability in operation.

Technical Specifications

Fixed Regulators - Positive Single Output Standard LP3879SDX-1.0 attributes and parameters. Explore more Fixed Regulators - Positive Single Output Standard devices from Texas Instruments

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

2 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

6 V

Minimum Input Voltage:

3 V

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e0

Length:

4 mm

Maximum Line Regulation:

.00096 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.8 A

Maximum Output Voltage-1:

1.03 V

Minimum Output Voltage-1:

.97 V

Nominal Output Voltage-1:

1 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.15,32

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

3 %

Width:

4 mm

Trade Compliance

LP3879SDX-1.0 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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