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LP3470A293DBVR

Texas Instruments

LP3470A293DBVR by Texas Instruments

LP3470A293DBVR by Texas Instruments is a Power Management IC with 5.5V nominal voltage, suitable for automotive applications. It features a small outline package style, dual terminal position, and CMOS technology. With a wide operating temperature range from -40 to 125 °C, it offers reliable power supply support in compact designs.

Median Price

$2.030

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 22,955 parts In-Stock

1+ parts

$1.228

100+ parts

$1.014

1k+ parts

$0.548

10k+ parts

-

22,955

$1.228

$1.014

$0.548

-

Mouser Electronics

USA . 5,562 parts In-Stock

1+ parts

$2.030

100+ parts

$1.210

1k+ parts

$1.090

10k+ parts

$0.972

5,562

$2.030

$1.210

$1.090

$0.972

DigiKey

USA . 4,265 parts In-Stock

1+ parts

$2.070

100+ parts

$1.239

1k+ parts

$1.124

10k+ parts

-

4,265

$2.070

$1.239

$1.124

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,744 parts In-Stock

1+ parts

$1.167

100+ parts

-

1k+ parts

-

10k+ parts

-

4,744

$1.167

-

-

-

Vyrian

USA . 3,420 parts In-Stock

1+ parts

$1.228

100+ parts

-

1k+ parts

-

10k+ parts

-

3,420

$1.228

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 8,527 parts In-Stock

1+ parts

$1.040

100+ parts

$1.014

1k+ parts

$1.009

10k+ parts

-

8,527

$1.040

$1.014

$1.009

-

Ampacity Inc.

Singapore . 8,273 parts In-Stock

1+ parts

$1.040

100+ parts

-

1k+ parts

-

10k+ parts

-

8,273

$1.040

-

-

-

Corphita

USA . 2,840 parts In-Stock

1+ parts

$1.105

100+ parts

-

1k+ parts

-

10k+ parts

-

2,840

$1.105

-

-

-

Corohmni

South Africa . 254 parts In-Stock

1+ parts

$1.228

100+ parts

-

1k+ parts

-

10k+ parts

-

254

$1.228

-

-

-

Component Stockers USA

USA . 15,461 parts In-Stock

1+ parts

$1.740

100+ parts

$1.270

1k+ parts

$0.600

10k+ parts

$0.600

15,461

$1.740

$1.270

$0.600

$0.600

Parana Technologies

USA . 291 parts In-Stock

1+ parts

$15.369

100+ parts

-

1k+ parts

$15.758

10k+ parts

-

291

$15.369

-

$15.758

-

DigiPath Technology Company

USA . 503 parts In-Stock

1+ parts

$16.923

100+ parts

$15.569

1k+ parts

-

10k+ parts

-

503

$16.923

$15.569

-

-

ChromeModa Solutions

Germany . 4,299 parts In-Stock

1+ parts

$17.268

100+ parts

$14.160

1k+ parts

-

10k+ parts

-

4,299

$17.268

$14.160

-

-

IDEA Electronic Components Group

UK . 555 parts In-Stock

1+ parts

$17.268

100+ parts

$16.405

1k+ parts

$15.541

10k+ parts

-

555

$17.268

$16.405

$15.541

-

Lixinc

USA . 16,665 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,665

-

-

-

-

Overview

Experience unparalleled power management with the LP3470A293DBVR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that are essential for various applications. The LP3470A293DBVR offers customers unmatched value and benefits, ensuring reliable performance and efficiency. Whether you're looking to enhance automotive systems or optimize power supply support circuits, this compact and versatile IC is the ideal solution. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package provides durability and impact resistance, making the product suitable for rugged environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, saving time and cost during manufacturing.

Nominal Supply Voltage (Vsup): 5.5 V

Suitable nominal supply voltage for powering various electronic components efficiently and effectively.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and ensure stable performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering onto PCBs, improving the overall assembly process and reliability of connections.

Technical Specifications

Power Management ICs LP3470A293DBVR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE-NOM= 2.93V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.45 mm

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.95 V

Nominal Supply Voltage (Vsup):

5.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

LP3470A293DBVR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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