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LP324M

Texas Instruments

LP324M by Texas Instruments

LP324M by Texas Instruments is a micropower operational amplifier with 4 functions, offering a max input offset voltage of 9000 uV and a nominal common mode reject ratio of 90 dB. Ideal for applications requiring low bias current and high voltage gain, this op amp operates at temperatures ranging from 0 to 70 °C.

Median Price

$0.550

Lifecycle Status

Suppliers In-Stock

33

In-Stock Inventory

1k+

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Rochester

USA . 717 parts In-Stock

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$0.530

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$0.440

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$0.392

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DigiKey

USA . 717 parts In-Stock

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$0.660

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Verical

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$0.490

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Greenchips

USA . 884 parts In-Stock

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$0.330

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$0.298

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Freelance Electronics

USA . 108 parts In-Stock

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$0.365

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$0.384

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Digiode

USA . 4,450 parts In-Stock

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Vyrian

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Anansix

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Component Sense

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Electronic Expediters

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Prism Electronics

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LIBRA Elektronik GmbH

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Bristol Electronics

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Chip Stock

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ACDS - Activité Composants Distribution Service

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PC Components Company LLC

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DF Sales Co.

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Ack Elektronik San.Tic.Ltd.Sti

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Fibra_Brandt Electronic GMBH

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North Shore Components

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Holdelec - ElecDif-Pro

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Corphita

USA . 773 parts In-Stock

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$0.390

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Vigor

Singapore . 3,217 parts In-Stock

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$0.420

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Parana Technologies

USA . 774 parts In-Stock

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$1.706

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$2.300

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DigiPath Technology Company

USA . 704 parts In-Stock

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$1.879

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ChromeModa Solutions

Germany . 2,732 parts In-Stock

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$1.917

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$1.572

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IDEA Electronic Components Group

UK . 1,101 parts In-Stock

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$1.725

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Infinite Electronics LLP (Excess)

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Microchip USA

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Alle Elektronik GmbH

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Overview

Elevate your electronics projects with the LP324M by Texas Instruments - a top-tier operational amplifier delivering exceptional performance and precision. Designed with quality in mind, this versatile Op Amp boasts four functions in a compact rectangular package, making it ideal for a wide range of applications. With a nominal unity gain bandwidth of 100 kHz and a micropower design, this amplifier offers customers unmatched value and reliability. Experience the benefits of superior technology and efficiency with the LP324M, setting new standards in the world of electronics engineering.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material makes the product lightweight and durable, suitable for various applications.

Maximum Input Offset Voltage: 9000 uV

Low input offset voltage helps in reducing errors in the amplifier's output signal, providing accurate results.

Surface Mount: YES

Surface mount capability makes the installation process easier and allows for compact designs.

Nominal Common Mode Reject Ratio: 90 dB

High common mode rejection ratio ensures effective rejection of unwanted signals, resulting in a cleaner output signal.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with a wide range of power supplies.

Technology: BIPOLAR

Bipolar technology offers high precision and low noise, making the operational amplifier suitable for sensitive applications.

Maximum Supply Current: 0.25 mA

Low supply current ensures efficient power consumption, ideal for battery-powered applications.

Technical Specifications

Operational Amplifiers (Op Amps) LP324M attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

5/30 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

No

Micropower:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

100 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

90 dB

Input Offset Voltage Limit:

9000 uV

Minimum Voltage Gain:

40000

Nominal Slew Rate:

50000 V/us

Peak Bias Current:

20 nA

Maximum Bias Current (IIB) @25 °C:

10 nA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

32 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

235 °C (455 °F)

Reflow Peak Time Limit:

20 s

Maximum Supply Current:

250 μA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin Lead

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

LP324M Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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