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LP2951ACM-3.0X

Texas Instruments

LP2951ACM-3.0X by Texas Instruments

LP2951ACM-3.0X by Texas Instruments is a fixed/adjustable positive single output LDO regulator with max output voltage of 29V and max dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring stable voltage regulation in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,808 parts In-Stock

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Anansix

USA . 1,989 parts In-Stock

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Digiode

USA . 1,128 parts In-Stock

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One Stop Electronics

USA . 144 parts In-Stock

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$0.500

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144

$0.500

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Parana Technologies

USA . 119 parts In-Stock

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$5.755

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$534.415

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$5.179

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119

$5.755

$534.415

$5.179

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DigiPath Technology Company

USA . 407 parts In-Stock

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$6.337

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407

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ChromeModa Solutions

Germany . 6,627 parts In-Stock

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$6.466

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$5.302

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$6.466

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IDEA Electronic Components Group

UK . 934 parts In-Stock

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$6.466

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$5.819

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934

$6.466

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$5.819

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AZTECH Wire

Italy . 424 parts In-Stock

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$10.329

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Corphita

USA . 1,469 parts In-Stock

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Overview

Elevate your power management solutions with the LP2951ACM-3.0X by Texas Instruments. Crafted with precision and expertise, this fixed & adjustable regulator offers unparalleled reliability and performance in a compact package. Perfect for a wide range of applications, this LDO regulator ensures stable output voltage with minimal dropout, making it ideal for powering sensitive electronics. Trust Texas Instruments to deliver top-notch quality and innovation, providing you with the value and advantages you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the internal components, ensuring durability and reliability of the regulator.

Maximum Dropout Voltage: 1.6 V

Low dropout voltage allows the regulator to maintain a stable output voltage even when the input voltage is close to the desired output voltage.

Surface Mount: YES

Surface mount capability makes it easy to integrate this regulator into compact electronic designs, saving space and simplifying assembly.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range allows the regulator to function in various environments without overheating or losing efficiency.

Technology: BIPOLAR

Bipolar technology provides reliable and consistent performance, making this regulator suitable for demanding applications.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy placement and mounting of the regulator on a circuit board.

Terminal Form: GULL WING

Gull wing terminals are robust and provide good solderability, ensuring secure connections and enhancing the regulator's overall reliability.

Operating Temperature (TJ-Min): -40 °C

Low minimum operating temperature range allows the regulator to function reliably even in cold environments.

Nominal Output Voltage: 3 V

Stable output voltage of 3V is suitable for powering a wide range of electronic devices and components.

No. of Terminals: 8

Having 8 terminals allows for multiple connection options, enabling flexibility in circuit design and layout.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, making it ideal for compact electronic designs.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration with other components on the circuit board, enabling efficient PCB layout.

Regulator Type: FIXED/ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

This regulator provides stable and reliable output voltage, with the flexibility to adjust the output as needed for different applications.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves the overall reliability of the connection between the regulator and the circuit board.

Maximum Output Voltage: 29 V

High maximum output voltage allows for compatibility with a wide range of electronic devices and components.

Maximum Seated Height: 1.75 mm

Low seated height facilitates placement in compact electronic designs, saving space and enabling efficient PCB layout.

Width: 3.9 mm

Narrow width allows for easy integration into tight spaces on the circuit board, enabling compact and efficient electronic designs.

Maximum Output Current: 1 A

High maximum output current makes this regulator suitable for powering a variety of electronic devices that require higher currents.

Length: 4.9 mm

Compact length allows for easy placement and mounting in electronic designs with limited space.

Technical Specifications

Fixed & Adjustable Regulators - Positive Single Output LDO LP2951ACM-3.0X attributes and parameters. Explore more Fixed & Adjustable Regulators - Positive Single Output LDO devices from Texas Instruments

Specs

Maximum Dropout Voltage-1:

.6 V

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.1 A

Maximum Output Voltage-1:

29 V

Minimum Output Voltage-1:

1.24 V

Nominal Output Voltage-1:

3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Qualification Status:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

LP2951ACM-3.0X Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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