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LMX2335UTMX

Texas Instruments

LMX2335UTMX by Texas Instruments

LMX2335UTMX by Texas Instruments is a PLL frequency synthesizer with 16 terminals, operating voltage range of 2.7V to 5.5V, and temperature range of -40°C to 85°C. It features a small outline package suitable for industrial applications requiring precise frequency synthesis in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,596 parts In-Stock

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5,596

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Digiode

USA . 5,272 parts In-Stock

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5,272

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Anansix

USA . 1,841 parts In-Stock

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1,841

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,099 parts In-Stock

1+ parts

$2.500

100+ parts

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1,099

$2.500

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AZTECH Wire

Italy . 872 parts In-Stock

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$5.806

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872

$5.806

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Parana Technologies

USA . 152 parts In-Stock

1+ parts

$7.383

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$7.875

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152

$7.383

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$7.875

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DigiPath Technology Company

USA . 1,423 parts In-Stock

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$8.129

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$7.479

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1,423

$8.129

$7.479

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ChromeModa Solutions

Germany . 964 parts In-Stock

1+ parts

$8.295

100+ parts

$6.802

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964

$8.295

$6.802

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IDEA Electronic Components Group

UK . 188 parts In-Stock

1+ parts

$8.295

100+ parts

$7.880

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$7.466

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188

$8.295

$7.880

$7.466

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Corphita

USA . 1,209 parts In-Stock

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1,209

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Overview

Enhance your electronic designs with the LMX2335UTMX by Texas Instruments, a top-quality Phase Locked Loop & Frequency Synthesis Circuit. Manufactured by industry leader Texas Instruments, this PLL Frequency Synthesizer offers unparalleled performance and reliability for a wide range of applications. With a low profile design, wide temperature range, and ease of installation, this product provides exceptional value and benefits to customers looking to optimize their systems. Upgrade your projects today with the LMX2335UTMX and experience enhanced performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the PLL & Frequency Synthesis Circuit.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving time and effort during manufacturing.

Nominal Supply Voltage (Vsup): 3 V

Suitable voltage for stable operation of the circuit, ensuring reliable performance.

Maximum Operating Temperature: 85 °C

Can withstand higher temperatures, making it suitable for industrial applications where heat may be a factor.

Width (mm): 4.4 mm

Compact size allows for integration into space-constrained designs.

Minimum Supply Voltage (Vsup): 2.7 V

Allows for flexibility in power supply options, accommodating a range of voltage inputs.

Temperature Grade: INDUSTRIAL

Designed to meet industrial standards for temperature tolerance and reliability.

Terminal Pitch: 0.65 mm

Fine pitch terminals enable high-density mounting on circuit boards, optimizing space usage.

Maximum Supply Voltage (Vsup): 5.5 V

Wide supply voltage range offers versatility in different operating conditions.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2335UTMX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LMX2335UTMX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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