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LMV824PWRE4

Texas Instruments

LMV824PWRE4 by Texas Instruments

LMV824PWRE4 by Texas Instruments is a micropower operational amplifier with 4 functions, offering a min voltage gain of 10k and nominal unity gain bandwidth of 5MHz. With a max input offset voltage of 4000uV, it is ideal for industrial applications requiring low bias current and high common mode rejection ratio. This op amp operates within a temperature range of -40 to 85°C and has a small outline package style suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,783 parts In-Stock

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Digiode

USA . 1,708 parts In-Stock

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1,708

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Distributors (Availability)

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Parana Technologies

USA . 1,304 parts In-Stock

1+ parts

$2.759

100+ parts

-

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$3.245

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1,304

$2.759

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$3.245

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DigiPath Technology Company

USA . 1,014 parts In-Stock

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$3.038

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$3.038

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ChromeModa Solutions

Germany . 4,921 parts In-Stock

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$3.100

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$2.542

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$3.100

$2.542

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IDEA Electronic Components Group

UK . 646 parts In-Stock

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$3.100

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$2.790

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646

$3.100

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$2.790

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One Stop Electronics

USA . 1,306 parts In-Stock

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$6.410

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1,306

$6.410

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AZTECH Wire

Italy . 722 parts In-Stock

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$7.489

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QUARKTWIN TECHNOLOGY LTD

USA . 17,139 parts In-Stock

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Microchip USA

USA . 4,893 parts In-Stock

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Corphita

USA . 815 parts In-Stock

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Overview

Discover the LMV824PWRE4 by Texas Instruments, a high-quality operational amplifier perfect for a wide range of applications. With Texas Instruments' reputation for excellence, this op amp offers unparalleled performance and reliability. Whether you're designing audio equipment, sensor interfaces, or precision instrumentation, this versatile component provides exceptional value with its low power consumption and robust design. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides high durability and protection for the internal components of the operational amplifier, making it suitable for various environmental conditions.

Maximum Input Offset Voltage: 4000 uV

Ensures accurate and precise signal processing, making it ideal for applications requiring high precision.

Maximum Average Bias Current (IIB): 0.14 uA

Low bias current ensures minimal power consumption and stable operation of the amplifier, making it efficient for low-power applications.

Surface Mount: YES

Facilitates easy and convenient mounting on PCBs, saving space and simplifying the assembly process.

Nominal Common Mode Reject Ratio: 85 dB

High common mode rejection ratio ensures efficient rejection of common-mode signals, leading to accurate and clean output signals.

Nominal Supply Voltage / Vsup (V): 2.7

Optimal supply voltage for the amplifier to ensure reliable and consistent performance in various applications.

Minimum Voltage Gain: 10000

High voltage gain capability allows for amplification of weak signals with minimal distortion, making it suitable for sensitive applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows the amplifier to function in diverse temperature environments, enhancing its versatility.

Technology: BIPOLAR

Bipolar technology offers stable and low-noise amplification, making the operational amplifier suitable for high-performance audio and precision measurement applications.

Nominal Unity Gain Bandwidth: 5000 kHz

High unity gain bandwidth enables the amplifier to handle high-frequency signals with accuracy and speed, making it suitable for bandwidth-demanding applications.

Technical Specifications

Operational Amplifiers (Op Amps) LMV824PWRE4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

2.5/5 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

4000 uV

Minimum Voltage Gain:

10000

Nominal Slew Rate:

1.7 V/us

Peak Bias Current:

140 nA

Maximum Bias Current (IIB) @25 °C:

100 nA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

5.5 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

1.5 mA

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

14

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP14,.25

Trade Compliance

LMV824PWRE4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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