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LMV232TLX

Texas Instruments

LMV232TLX by Texas Instruments

LMV232TLX by Texas Instruments is a linear detector with a frequency range of 50-2000 MHz. It operates b/w -40°C to 85°C and has a characteristic impedance of 50 ohm. Ideal for RF applications, this component offers Tin/Silver/Copper terminal finish for reliable performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,583 parts In-Stock

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Digiode

USA . 2,254 parts In-Stock

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Anansix

USA . 2,067 parts In-Stock

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2,067

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Distributors (Availability)

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Parana Technologies

USA . 30 parts In-Stock

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$2.419

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$2.916

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30

$2.419

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$2.916

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DigiPath Technology Company

USA . 396 parts In-Stock

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$2.664

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396

$2.664

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ChromeModa Solutions

Germany . 5,301 parts In-Stock

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$2.718

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$2.229

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$2.718

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IDEA Electronic Components Group

UK . 454 parts In-Stock

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$2.718

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$2.446

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454

$2.718

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$2.446

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AZTECH Wire

Italy . 414 parts In-Stock

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$6.284

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One Stop Electronics

USA . 194 parts In-Stock

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$21.000

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Corphita

USA . 2,337 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,560 parts In-Stock

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Overview

Discover the LMV232TLX by Texas Instruments, a top-of-the-line RF/Microwave Detector that offers unparalleled quality and precision. Known for their innovative solutions, Texas Instruments delivers a product designed to exceed expectations in performance and reliability. Ideal for a wide range of applications, this linear detector provides accurate results from 50 MHz to 2000 MHz. Experience the value and benefits of the LMV232TLX, where quality meets efficiency for all your detection needs. Trust Texas Instruments to deliver excellence in every component.

Feature Benefit Bullets

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this detector can withstand high temperatures, ensuring reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this detector suitable for use in cold climates or applications where temperature variations are common.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of Tin/Silver/Copper provides excellent conductivity and corrosion resistance, enhancing the overall performance and durability of the detector.

RF or Microwave Device Type: LINEAR DETECTOR

Being a linear detector, this product is capable of accurately measuring RF or microwave signals with minimal distortion, making it ideal for precise detection applications.

Characteristic Impedance: 50 ohm

With a characteristic impedance of 50 ohm, this detector is compatible with standard RF and microwave systems, ensuring seamless integration and reliable signal detection.

Minimum Operating Frequency: 50 MHz

The minimum operating frequency of 50 MHz allows this detector to detect a wide range of RF and microwave signals, making it versatile for various applications.

Maximum Operating Frequency: 2000 MHz

With a high maximum operating frequency of 2000 MHz, this detector is capable of detecting higher frequency signals with accuracy, making it suitable for advanced RF and microwave systems.

Technical Specifications

RF/Microwave Detectors LMV232TLX attributes and parameters. Explore more RF/Microwave Detectors devices from Texas Instruments

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

JESD-609 Code:

e1

Maximum Operating Frequency:

2000 MHz

Minimum Operating Frequency:

50 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

RF or Microwave Device Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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