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LMV225TLEVAL

Texas Instruments

LMV225TLEVAL by Texas Instruments

LMV225TLEVAL by Texas Instruments is an Evaluation Board for the LMV225 Power Detector, CDMA type, with a frequency range of 450MHz to 2GHz. It comes in a Box package and is suitable for RF evaluation and development applications. The board includes components needed for testing and development purposes.

Median Price

$111.375

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Texas Instruments

USA . 5 parts In-Stock

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$99.000

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DigiKey

USA . 1 parts In-Stock

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$123.750

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$123.750

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Digiode

USA . 2,438 parts In-Stock

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$94.050

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Vyrian

USA . 6,190 parts In-Stock

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Semicontronic

India . 4 parts In-Stock

1+ parts

$84.150

100+ parts

$82.046

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$81.626

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$84.150

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Corphita

USA . 4,921 parts In-Stock

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$89.100

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$89.100

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Corohmni

South Africa . 321 parts In-Stock

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$99.000

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IDEA Electronic Components Group

UK . 2,106 parts In-Stock

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Parana Technologies

USA . 1,387 parts In-Stock

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$1.358

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ChromeModa Solutions

Germany . 845 parts In-Stock

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DigiPath Technology Company

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Perfect Parts

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Overview

Experience the unrivaled quality and reliability of Texas Instruments with the LMV225TLEVAL evaluation board. This versatile power detector board is perfect for a wide range of applications in the RF industry, offering unparalleled performance and precision. Take your projects to the next level with the LMV225TLEVAL and discover the value and benefits that Texas Instruments brings to your work.

Feature Benefit Bullets

Frequency: 450MHz ~ 2GHz

This wide frequency range allows for testing and development across a broad spectrum, making it versatile for various RF applications.

For Use With/Related Products: LMV225

Designed to be used with LMV225, ensuring compatibility and seamless integration with the specified base product.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

With an MSL of 1 (Unlimited), this product has a low sensitivity to moisture, ensuring long-term reliability even in humid environments.

Technical Specifications

Additional Parts LMV225TLEVAL attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Type:

Power Detector, CDMA

Category:

Development Boards, Kits, Programmers
Evaluation Boards RF Evaluation and Development Kits, Boards

For Use With/Related Products:

LMV225

Supplied Contents:

Board(s)

Frequency:

450MHz ~ 2GHz

Package:

Box

Standard Package:

1

Base Product Number:

LMV225

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

LMV225TLEVAL Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

9030.90.6600

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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