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LMP90099MHE/NOPB

Texas Instruments

LMP90099MHE/NOPB by Texas Instruments

LMP90099MHE/NOPB by Texas Instruments is a 28-terminal analog circuit IC with a supply voltage range of 2.85V to 5.5V, operating b/w -40°C to 125°C. It features a small outline package style suitable for automotive applications, with dual terminal position and gull wing form for surface mount assembly.

Median Price

$11.722

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,840 parts In-Stock

1+ parts

$11.969

100+ parts

$9.758

1k+ parts

$6.505

10k+ parts

-

3,840

$11.969

$9.758

$6.505

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DigiKey

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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$11.722

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2,500

-

-

$11.722

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Chip1Stop

Japan . 250 parts In-Stock

1+ parts

-

100+ parts

-

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$8.444

10k+ parts

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250

-

-

$8.444

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$8.110

100+ parts

-

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10

$8.110

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-

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Digiode

USA . 3,020 parts In-Stock

1+ parts

$11.371

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3,020

$11.371

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Anansix

USA . 2,402 parts In-Stock

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2,402

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Vyrian

USA . 1,956 parts In-Stock

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1,956

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Chip Stock

USA . 425 parts In-Stock

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425

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,147 parts In-Stock

1+ parts

$7.180

100+ parts

$7.000

1k+ parts

$6.965

10k+ parts

-

2,147

$7.180

$7.000

$6.965

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Ampacity Inc.

Singapore . 1,712 parts In-Stock

1+ parts

$7.180

100+ parts

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1,712

$7.180

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Continental Prestige Electronics

USA . 1,013 parts In-Stock

1+ parts

$8.110

100+ parts

-

1k+ parts

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$7.948

1,013

$8.110

-

-

$7.948

Corphita

USA . 4,156 parts In-Stock

1+ parts

$10.772

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4,156

$10.772

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Parana Technologies

USA . 1,111 parts In-Stock

1+ parts

$17.196

100+ parts

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$17.411

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1,111

$17.196

-

$17.411

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DigiPath Technology Company

USA . 1,199 parts In-Stock

1+ parts

$18.935

100+ parts

$17.420

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1,199

$18.935

$17.420

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Corohmni

South Africa . 689 parts In-Stock

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$18.982

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689

$18.982

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ChromeModa Solutions

Germany . 5,312 parts In-Stock

1+ parts

$19.321

100+ parts

$15.843

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5,312

$19.321

$15.843

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IDEA Electronic Components Group

UK . 709 parts In-Stock

1+ parts

$19.321

100+ parts

$18.355

1k+ parts

$17.389

10k+ parts

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709

$19.321

$18.355

$17.389

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QUARKTWIN TECHNOLOGY LTD

USA . 29,368 parts In-Stock

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29,368

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Argo Parts USA

USA . 2,910 parts In-Stock

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2,910

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Perfect Parts

USA . 440 parts In-Stock

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440

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Overview

Unlock the potential of your automotive applications with the LMP90099MHE/NOPB by Texas Instruments. Designed with precision and reliability in mind, this analog circuit IC offers unmatched performance in a compact small outline package. With a wide supply voltage range and dual terminal position, this versatile semiconductor is ideal for various functions in your automotive electronics. Trust Texas Instruments for quality and innovation, and experience the value and benefits of the LMP90099MHE/NOPB in optimizing your designs for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, ideal for various applications.

Surface Mount: YES

With the surface-mount capability, this product simplifies the PCB assembly process and saves space on the board.

Package Shape: RECTANGULAR

The rectangular package shape of this product allows for easy placement and alignment on the PCB, improving overall design efficiency.

Nominal Supply Voltage (Vsup): 3 V

The 3V nominal supply voltage ensures compatibility with a wide range of electronic systems, providing flexibility in use.

No. of Terminals: 28

The high number of terminals allows for versatile connectivity options, making this product suitable for complex circuit designs.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style offers a compact design, perfect for space-constrained applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environmental conditions, ensuring reliability in extreme situations.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C makes this product suitable for use in both hot and cold environments, increasing its versatility.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent conductivity and corrosion resistance, enhancing the overall performance and reliability of the product.

Terminal Position: DUAL

The dual terminal position allows for increased flexibility in PCB layout and connectivity, making this product adaptable to various design requirements.

Technical Specifications

Other Function Semiconductors LMP90099MHE/NOPB attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

Maximum Input Voltage:

5.5 V

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

7

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.85 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

LMP90099MHE/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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