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LMH0376SQX/NOPB

Texas Instruments

LMH0376SQX/NOPB by Texas Instruments

LMH0376SQX/NOPB by Texas Instruments is an interface IC with a supply voltage of 2.5V, operating temperature range of -40 to 85°C, and terminal pitch of 0.5mm. It is used in industrial applications requiring a very thin profile chip carrier package for surface mount assembly.

Median Price

$28.261

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,686 parts In-Stock

1+ parts

$28.261

100+ parts

$25.121

1k+ parts

$18.471

10k+ parts

-

19,686

$28.261

$25.121

$18.471

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,219 parts In-Stock

1+ parts

$26.848

100+ parts

-

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4,219

$26.848

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Vyrian

USA . 6,568 parts In-Stock

1+ parts

-

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6,568

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,235 parts In-Stock

1+ parts

$6.761

100+ parts

-

1k+ parts

$7.426

10k+ parts

-

1,235

$6.761

-

$7.426

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DigiPath Technology Company

USA . 380 parts In-Stock

1+ parts

$7.445

100+ parts

$6.849

1k+ parts

-

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380

$7.445

$6.849

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ChromeModa Solutions

Germany . 2,229 parts In-Stock

1+ parts

$7.597

100+ parts

$6.230

1k+ parts

-

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2,229

$7.597

$6.230

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IDEA Electronic Components Group

UK . 1,981 parts In-Stock

1+ parts

$7.597

100+ parts

-

1k+ parts

$6.837

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1,981

$7.597

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$6.837

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AZTECH Wire

Italy . 187 parts In-Stock

1+ parts

$19.750

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187

$19.750

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Ampacity Inc.

Singapore . 19,266 parts In-Stock

1+ parts

$24.020

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19,266

$24.020

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Corphita

USA . 2,867 parts In-Stock

1+ parts

$25.435

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2,867

$25.435

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iodParts Technologies Inc.

India . 100 parts In-Stock

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100

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Overview

Experience the power of cutting-edge technology with the LMH0376SQX/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This Interface IC is designed for various applications, offering unmatched performance and versatility. Enhance your projects with the LMH0376SQX/NOPB, providing exceptional value and benefits to customers seeking innovative solutions. Elevate your designs and achieve superior results with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the IC, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy and convenient installation on a PCB, saving time and effort during assembly.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in high temperature environments, making it ideal for industrial applications.

Nominal Supply Voltage: 2.5 V

Operates efficiently at a low voltage, helping to reduce power consumption and heat dissipation.

Technical Specifications

Other Function Interface ICs LMH0376SQX/NOPB attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

LMH0376SQX/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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