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LME49830TB

Texas Instruments

LME49830TB by Texas Instruments

LME49830TB by Texas Instruments is an audio amplifier IC with low harmonic distortion of 0.05%. It operates in industrial temperature range from -40 to 85°C and supports supply voltage from 20V to 100V. This rectangular package with flange mount is ideal for audio and video amplification applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,409 parts In-Stock

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6,409

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Digiode

USA . 3,235 parts In-Stock

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Anansix

USA . 1,328 parts In-Stock

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1,328

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,525 parts In-Stock

1+ parts

$2.463

100+ parts

-

1k+ parts

$2.956

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$2.463

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$2.956

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DigiPath Technology Company

USA . 2,036 parts In-Stock

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$2.712

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2,036

$2.712

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ChromeModa Solutions

Germany . 4,152 parts In-Stock

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$2.767

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$2.269

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4,152

$2.767

$2.269

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IDEA Electronic Components Group

UK . 212 parts In-Stock

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$2.767

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$2.490

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212

$2.767

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$2.490

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One Stop Electronics

USA . 1,535 parts In-Stock

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$6.800

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1,535

$6.800

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AZTECH Wire

Italy . 527 parts In-Stock

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$11.248

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527

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Corphita

USA . 2,478 parts In-Stock

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Perfect Parts

USA . 2,240 parts In-Stock

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Lixinc

USA . 303 parts In-Stock

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Overview

Elevate your audio experience with the LME49830TB by Texas Instruments. Crafted with precision and expertise, this audio amplifier delivers unparalleled quality and performance. Whether you're a music enthusiast or a professional in the sound industry, this product is designed to meet all your needs. From its durable construction to its wide range of applications, the LME49830TB offers exceptional value and benefits that will elevate your audio projects to the next level. Trust Texas Instruments to provide you with the best in audio amplifiers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material is durable and lightweight, making the amplifier easy to handle and suitable for a variety of audio applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement and installation of the amplifier in different audio setups.

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier ensures high-quality sound reproduction and optimal performance for audio playback.

Harmonic Distortion: 0.05%

The low harmonic distortion of 0.05% ensures that the audio output is clean and free from unwanted noise or distortion, providing a clear sound experience.

No. of Terminals: 15

Having 15 terminals allows for versatile connectivity options and compatibility with a range of audio devices and components.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure mounting and stable operation of the amplifier, reducing the risk of vibrations or movement affecting audio quality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that the amplifier can withstand extended use and operate reliably even in demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the amplifier to be used in a wide range of environments, including cold or outdoor settings.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent conductivity and corrosion resistance, ensuring stable connections and long-lasting performance.

Terminal Position: ZIG-ZAG

The zig-zag terminal position allows for efficient routing of wires and cables, making installation and wiring of the amplifier easier and more organized.

Minimum Supply Voltage (Vsup): 20 V

The 20V minimum supply voltage ensures that the amplifier can operate efficiently and reliably, providing consistent audio output even under low power conditions.

Maximum Time At Peak Reflow Temperature (s): 40

The 40-second maximum reflow time at peak temperature of 260°C ensures that the soldering process is precise and reliable, resulting in a durable and well-assembled amplifier.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient and effective soldering of the amplifier components, ensuring a strong and lasting connection.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification indicates that the amplifier is designed to withstand harsh industrial environments and perform reliably under extreme temperature conditions.

Nominal Bandwidth: 0.02 kHz

The nominal bandwidth of 0.02 kHz ensures that the amplifier can accurately reproduce audio signals within a precise frequency range, delivering high-fidelity sound performance.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for secure and stable connections, making installation and maintenance of the amplifier easier and more reliable.

Maximum Supply Voltage (Vsup): 100 V

The 100V maximum supply voltage provides flexibility and compatibility with a wide range of power sources, ensuring the amplifier can be used in various audio setups without voltage limitations.

Technical Specifications

Audio & Video Amplifiers LME49830TB attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Harmonic Distortion:

.05 %

JESD-30 Code:

R-PZFM-T15

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

15

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Maximum Supply Voltage (Vsup):

100 V

Minimum Supply Voltage (Vsup):

20 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

ZIG-ZAG

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

LME49830TB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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