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LM60CIM3

Texas Instruments

LM60CIM3 by Texas Instruments

LM60CIM3 by Texas Instruments is a temperature sensor with voltage output. It operates on 2.7-10 V supplies, offering accuracy of 4 °C and positive temperature coefficient. Ideal for surface mount applications, it has a max operating temp of 125 °C and dimensions of 1.3" x 1.015 mm x 2.92 mm.

Median Price

$1.772

Lifecycle Status

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Chip1Stop

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Mouser Electronics

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Verical

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Nova Conductors

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Ampacity Inc.

Singapore . 1,660 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 1,870 parts In-Stock

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IDEA Electronic Components Group

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Overview

Discover the Texas Instruments LM60CIM3, a top-notch temperature sensor that offers unparalleled accuracy and reliability. Manufactured by industry leader Texas Instruments, this sensor is perfect for a wide range of applications. Whether you need precise temperature monitoring in automotive systems, industrial equipment, or consumer electronics, the LM60CIM3 delivers exceptional performance. With a maximum operating temperature of 125°C and a BIPOLAR technology, this sensor ensures accurate readings every time. Trust Texas Instruments for quality and innovation in temperature sensing solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the sensor durable and resistant to harsh environmental conditions, ensuring a long product life.

Maximum Supply Voltage: 10 V

The high maximum supply voltage allows for flexibility in power sources and compatibility with a wide range of electronic circuits.

Body Width: 1.3 inch

Compact size of 1.3 inch makes it easy to integrate this sensor into various applications without taking up too much space.

Power Supplies (V): 3

Requires low power supply (3V), making it energy-efficient and suitable for battery-powered devices.

Sensors or Transducers Type: TEMPERATURE SENSOR,ANALOG,VOLTAGE OUTPUT

An analog temperature sensor with voltage output provides accurate temperature data in a format that is easy to process and analyze.

No. of Terminals: 3

Three terminals provide a simple and efficient setup for connecting the sensor to a circuit, reducing installation complexity.

Body Height: 1.015 mm

Low body height of 1.015 mm allows for a compact design and easy integration into small spaces.

Package Shape or Style: RECTANGULAR

Rectangular shape makes it easy to mount and secure the sensor in place, ensuring reliable and stable temperature readings.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage of 2.7V ensures the sensor can operate efficiently even in low-power situations.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C allows the sensor to perform reliably in a wide range of temperature environments.

Minimum Output Voltage: 0.174 V

Low minimum output voltage ensures accurate temperature readings even at lower temperature ranges.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C enables the sensor to function in extremely cold conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good conductivity and solderability, ensuring a reliable connection with the circuit.

Maximum Output Voltage: 1.205 V

High maximum output voltage of 1.205V provides a wide voltage range for accurate temperature measurements.

Maximum Operating Current: 0.11 mA

Low maximum operating current of 0.11mA reduces power consumption and heat generation, ideal for energy-efficient applications.

Technology: BIPOLAR

Bipolar technology offers high precision and accuracy in temperature sensing, ensuring reliable and consistent performance.

Maximum Accuracy °C: 4

High maximum accuracy of 4°C provides precise temperature readings, making it suitable for applications requiring tight temperature control.

Body Length/Diameter: 2.92 mm

Compact body length of 2.92 mm allows for easy integration into small or tight spaces, maximizing versatility.

Temperature Coef (ppm/°C): POSITIVE

Positive temperature coefficient ensures that the sensor maintains accuracy over a wide temperature range, making it reliable in varying conditions.

Termination Type: SOLDER

Solder termination type provides a secure and durable connection, ensuring the sensor remains reliably connected to the circuit.

Nominal R0: 800 ohm

Nominal resistance of 800 ohms offers a stable baseline for temperature measurements, contributing to the sensor's accuracy.

Mounting Feature: SURFACE MOUNT

Surface mounting feature allows for quick and easy installation on circuit boards, improving overall efficiency.

Technical Specifications

Temperature Sensors LM60CIM3 attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Maximum Accuracy (Cel):

4

Body Width:

1.3 inch

Body Height:

1.015 mm

Body Length/Diameter:

2.92 mm

JESD-609 Code:

e0

Mounting Feature:

No. of Terminals:

3

Maximum Operating Current:

.11 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

1.205 V

Minimum Output Voltage:

.174 V

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

TO-236

Package Shape or Style:

Power Supplies (V):

3

Nominal R0:

800 ohm

Sensors or Transducers Type:

Sub-Category:

Other Sensors/Transducers

Maximum Supply Voltage:

10 V

Minimum Supply Voltage:

2.7 V

Technology:

BIPOLAR

Temperature Coef (ppm/Cel):

POSITIVE

Terminal Finish:

Tin/Lead (Sn/Pb)

Termination Type:

SOLDER

Trade Compliance

LM60CIM3 Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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