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LM5080MM

Texas Instruments

LM5080MM by Texas Instruments

LM5080MM by Texas Instruments is an 8-terminal IC with a nominal voltage of 5V, suitable for industrial applications. It features a small outline package style, peak reflow temperature of 260°C, and operates b/w -40 to 105°C. This analog circuit has a max supply current of 5.5mA and can handle up to 14V supply voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,922 parts In-Stock

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5,922

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Digiode

USA . 4,810 parts In-Stock

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4,810

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Chip Stock

USA . 3,680 parts In-Stock

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3,680

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Anansix

USA . 341 parts In-Stock

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341

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Euro-Tech

UK . 15 parts In-Stock

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15

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One Stop Electronics

USA . 991 parts In-Stock

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$5.500

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991

$5.500

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AZTECH Wire

Italy . 562 parts In-Stock

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$6.956

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562

$6.956

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Parana Technologies

USA . 1,080 parts In-Stock

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$8.363

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$8.993

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1,080

$8.363

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$8.993

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ChromeModa Solutions

Germany . 5,771 parts In-Stock

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$9.397

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$7.706

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$9.397

$7.706

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IDEA Electronic Components Group

UK . 23 parts In-Stock

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$9.397

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$8.927

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$8.457

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23

$9.397

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$8.457

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Corphita

USA . 4,444 parts In-Stock

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Perfect Parts

USA . 3,592 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,244 parts In-Stock

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DigiPath Technology Company

USA . 2,237 parts In-Stock

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$8.472

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$8.472

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Kepictronics

USA . 60 parts In-Stock

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Overview

Discover the LM5080MM by Texas Instruments, a high-quality Other Function Semiconductor that offers reliability and performance. With a focus on innovation and excellence, Texas Instruments delivers cutting-edge solutions for various applications. The LM5080MM provides unparalleled value with its compact design and wide operating temperature range, making it ideal for industrial settings. Experience the advantages of this Analog Circuit IC, from its low power consumption to its ease of installation. Trust Texas Instruments for your semiconductor needs and elevate your projects to new heights with the LM5080MM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides good durability and protection for the semiconductor components inside, ensuring reliable performance over time.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, making the product suitable for mass production and integration into various electronic devices.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard nominal supply voltage of 5V makes this product compatible with a wide range of electronic systems and applications.

No. of Terminals: 8

Having 8 terminals allows for more connections and functionality, offering versatility in circuit design and potential applications for the product.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, this product can withstand high temperature environments, ensuring reliable performance in various industrial settings.

Terminal Finish: TIN LEAD

The use of tin lead terminal finish provides good solderability and conductivity, facilitating easy and secure connections during assembly.

Width (mm): 3 mm

Having a small width of 3mm allows for compact and space-saving designs, making this product suitable for applications with limited space constraints.

Minimum Supply Voltage (Vsup): 3 V

Operating at a minimum supply voltage of 3V ensures compatibility with low-power systems, offering energy efficiency and flexibility in power requirements.

Maximum Supply Current (Isup): 5.5 mA

With a maximum supply current of 5.5mA, this product consumes low power, making it ideal for battery-operated devices and energy-efficient applications.

Terminal Pitch: 0.65 mm

Having a small terminal pitch of 0.65mm allows for high-density mounting, enabling more components to be placed on a PCB and increasing overall design flexibility.

Technical Specifications

Other Function Semiconductors LM5080MM attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.09 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

5.5 mA

Maximum Supply Voltage (Vsup):

14 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3 mm

Trade Compliance

LM5080MM Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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