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LM5066IPMHE/NOPB

Texas Instruments

LM5066IPMHE/NOPB by Texas Instruments

LM5066IPMHE/NOPB by Texas Instruments is a Power Management IC with 28 terminals, operating at -40 to 125 °C. It supports up to 80V supply voltage, has a max output current of 500A, and is ideal for automotive applications.

Median Price

$5.724

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 1,192 parts In-Stock

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$5.724

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$5.000

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$3.448

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$3.448

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Digiode

USA . 2,812 parts In-Stock

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$5.438

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$5.438

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Nova Conductors

Japan . 23 parts In-Stock

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$5.665

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Vyrian

USA . 4,395 parts In-Stock

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Chip Stock

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995

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Dynamic Solutions

Germany . 600 parts In-Stock

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600

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Bristol Electronics

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286

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Connector Distribution Corp

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201

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Right Parts Inc.

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201

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Sensible Micro Corp

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20

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Distributors (Availability)

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Parana Technologies

USA . 522 parts In-Stock

1+ parts

$2.175

100+ parts

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$2.687

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522

$2.175

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$2.687

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DigiPath Technology Company

USA . 1,802 parts In-Stock

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$2.395

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$2.204

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1,802

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ChromeModa Solutions

Germany . 2,258 parts In-Stock

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$2.444

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$2.004

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IDEA Electronic Components Group

UK . 228 parts In-Stock

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$2.444

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$2.200

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Semicontronic

India . 1,021 parts In-Stock

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$4.870

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$4.748

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$4.724

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$4.724

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Ampacity Inc.

Singapore . 898 parts In-Stock

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Corphita

USA . 3,055 parts In-Stock

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Corohmni

South Africa . 404 parts In-Stock

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$5.517

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Continental Prestige Electronics

USA . 6,318 parts In-Stock

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$5.665

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$5.552

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Netroflash

USA . 1,000 parts In-Stock

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$5.665

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$5.552

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$5.683

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$5.398

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Lixinc

USA . 11,144 parts In-Stock

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A-Z Elektronik GmbH

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Argo Parts USA

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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Lucentia Tech

USA . 300 parts In-Stock

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Benley Electronics

USA . 140 parts In-Stock

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iodParts Technologies Inc.

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Overview

Elevate your power management solutions with the LM5066IPMHE/NOPB by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers yet again with this Power Management IC. Ideal for a variety of applications, this small outline, heat sink package offers customers the perfect balance of performance and efficiency. With adjustable thresholds, a wide supply voltage range, and high output current capabilities, this IC is designed to meet all your power supply needs with ease. Trust Texas Instruments to provide you with the best in power management technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good thermal performance and durability, making the product suitable for a wide range of applications.

Surface Mount: YES

Easy to install and saves PCB space, making it convenient for compact designs.

Nominal Supply Voltage (Vsup): 48 V

Ideal for applications requiring a stable supply voltage of 48V.

No. of Terminals: 28

Sufficient number of terminals for connecting various components, providing flexibility in circuit design.

Maximum Operating Temperature: 125 °C

Ability to operate at high temperatures ensures reliability in challenging environments.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability and corrosion resistance, ensuring long-term reliability.

Width (mm): 4.4 mm

Compact width allows for space-efficient placement on the PCB.

Minimum Supply Voltage (Vsup): 10 V

Supports a minimum supply voltage of 10V, enabling compatibility with a wide range of power sources.

Maximum Output Current: 500 A

High output current capability makes the product suitable for power-hungry applications.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature and reliability, ensuring performance in automotive applications.

Technical Specifications

Power Management ICs LM5066IPMHE/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

500 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Current (Isup):

9.5 mA

Maximum Supply Voltage (Vsup):

80 V

Minimum Supply Voltage (Vsup):

10 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+7.8V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

LM5066IPMHE/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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