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LM4040D30QDBZRG4

Texas Instruments

LM4040D30QDBZRG4 by Texas Instruments

LM4040D30QDBZRG4 by Texas Instruments is a 3V voltage reference with ±1% max voltage tolerance, ideal for automotive applications. It operates b/w -40 to 125°C, offering a min output voltage of 2.97V and max of 3.03V in a small outline package suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,879 parts In-Stock

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Digiode

USA . 1,115 parts In-Stock

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Nova Conductors

Japan . 78 parts In-Stock

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78

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One Stop Electronics

USA . 1,509 parts In-Stock

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$3.500

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$3.500

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Parana Technologies

USA . 190 parts In-Stock

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$5.884

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$6.666

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190

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$6.666

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AZTECH Wire

Italy . 489 parts In-Stock

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$6.070

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489

$6.070

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DigiPath Technology Company

USA . 1,549 parts In-Stock

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$6.479

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$5.960

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$6.479

$5.960

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Ampacity Inc.

Singapore . 1,546 parts In-Stock

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$6.500

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ChromeModa Solutions

Germany . 1,765 parts In-Stock

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$6.611

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$5.421

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$6.611

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IDEA Electronic Components Group

UK . 1,507 parts In-Stock

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$6.611

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$5.950

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$6.611

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$5.950

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Microchip USA

USA . 2,355 parts In-Stock

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Corphita

USA . 2,198 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Overview

Elevate your electronic designs with the LM4040D30QDBZRG4 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers voltage references that set the standard in the industry. Ideal for a wide range of applications, this product offers precise output voltage, ensuring optimal performance in your projects. With a compact design and high temperature tolerance, customers can trust in the value and benefits this voltage reference provides. Upgrade your electronics today with the LM4040D30QDBZRG4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 5 V

Matches the standard supply voltage in many electronic systems, ensuring compatibility with existing setups.

Minimum Output Voltage: 2.97 V

Provides a stable and precise output voltage, crucial for accurate reference voltage applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for a wide range of operating conditions.

Technology: BIPOLAR

Offers consistent performance and low noise levels, ideal for applications requiring high accuracy.

Terminal Pitch: 0.95 mm

Enables compact PCB designs and facilitates close component placement for efficient space utilization.

Max Voltage Temp Coef: 150 ppm/°C

Provides minimal voltage drift with temperature changes, ensuring stable and reliable voltage references over a wide temperature range.

Technical Specifications

Voltage References LM4040D30QDBZRG4 attributes and parameters. Explore more Voltage References devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e4

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

3.03 V

Minimum Output Voltage:

2.97 V

Nominal Output Voltage:

3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.12 mm

Sub-Category:

Voltage References

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Max Voltage Temp Coef:

150 ppm/Cel

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trim or Adjustable Output (V):

NO

Maximum Voltage Tolerance:

1 %

Width (mm):

1.3 mm

Trade Compliance

LM4040D30QDBZRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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