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LM4040D20QDBZTG4

Texas Instruments

LM4040D20QDBZTG4 by Texas Instruments

LM4040D20QDBZTG4 by Texas Instruments is a 5V voltage reference in a small outline package. With a min output voltage of 2.028V and max tolerance of 1%, it's ideal for automotive applications requiring precise voltage regulation at temperatures ranging from -40 to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,725 parts In-Stock

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Digiode

USA . 2,533 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 38 parts In-Stock

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Prism Electronics

USA . 2 parts In-Stock

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One Stop Electronics

USA . 171 parts In-Stock

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$1.500

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Ampacity Inc.

Singapore . 1,499 parts In-Stock

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$2.500

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$2.500

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Parana Technologies

USA . 1,046 parts In-Stock

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$10.004

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$928.986

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$9.003

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1,046

$10.004

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$9.003

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DigiPath Technology Company

USA . 1,719 parts In-Stock

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$11.015

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$10.134

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$11.015

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ChromeModa Solutions

Germany . 4,643 parts In-Stock

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$11.240

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$9.217

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IDEA Electronic Components Group

UK . 191 parts In-Stock

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$11.240

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$10.678

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$10.116

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191

$11.240

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AZTECH Wire

Italy . 487 parts In-Stock

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$11.754

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Component Stockers USA

USA . 312 parts In-Stock

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$99.990

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Corphita

USA . 3,415 parts In-Stock

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Microchip USA

USA . 2,324 parts In-Stock

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Overview

Elevate your electronic designs with the LM4040D20QDBZTG4 by Texas Instruments. Crafted with precision and innovation, this voltage reference offers unparalleled reliability and accuracy for a wide range of applications. Whether you're working on automotive electronics or industrial machinery, this small outline, thin profile package provides a stable 5V supply voltage with minimal temperature drift. Trust in Texas Instruments to deliver high-quality components that meet your performance standards. Experience the value and benefits of the LM4040D20QDBZTG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the voltage reference.

Surface Mount: YES

Allows for easy PCB assembly and saves space on the board.

Nominal Supply Voltage (Vsup): 5 V

Suitable for various applications requiring a stable 5V reference voltage.

Minimum Output Voltage: 2.028 V

Ensures a precise and accurate output voltage within a tight range.

Maximum Operating Temperature: 125 °C

Allows the voltage reference to operate in high-temperature environments without compromising performance.

Temperature Grade: AUTOMOTIVE

Certifies that the voltage reference meets automotive industry standards for reliability and performance in harsh conditions.

Technical Specifications

Voltage References LM4040D20QDBZTG4 attributes and parameters. Explore more Voltage References devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e4

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

2.068 V

Minimum Output Voltage:

2.028 V

Nominal Output Voltage:

2.048 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.12 mm

Sub-Category:

Voltage References

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Max Voltage Temp Coef:

150 ppm/Cel

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trim or Adjustable Output (V):

NO

Maximum Voltage Tolerance:

1 %

Width (mm):

1.3 mm

Trade Compliance

LM4040D20QDBZTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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