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LM4040C30IDBZRG4

Texas Instruments

LM4040C30IDBZRG4 by Texas Instruments

LM4040C30IDBZRG4 by Texas Instruments is a 3V voltage reference IC with ±0.5% max voltage tolerance, ideal for industrial applications. It operates b/w -40°C to 85°C, offering a min output voltage of 2.985V and max of 3.015V in a small outline package suitable for surface mount technology.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 38,790 parts In-Stock

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Vyrian

USA . 2,244 parts In-Stock

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Digiode

USA . 336 parts In-Stock

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Nova Conductors

Japan . 30 parts In-Stock

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One Stop Electronics

USA . 321 parts In-Stock

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$1.500

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Semicontronic

India . 841 parts In-Stock

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$4.500

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$4.388

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$4.365

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Ampacity Inc.

Singapore . 208 parts In-Stock

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$5.500

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AZTECH Wire

Italy . 436 parts In-Stock

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Parana Technologies

USA . 216 parts In-Stock

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$20.790

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$20.946

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DigiPath Technology Company

USA . 1,288 parts In-Stock

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$22.893

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$21.061

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ChromeModa Solutions

Germany . 6,111 parts In-Stock

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IDEA Electronic Components Group

UK . 1,841 parts In-Stock

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Corohmni

South Africa . 247 parts In-Stock

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Continental Prestige Electronics

USA . 4,765 parts In-Stock

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Corphita

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Argo Parts USA

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Microchip USA

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Bastille Electronics

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Overview

Enhance your electronic designs with the LM4040C30IDBZRG4 voltage reference from Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers top-notch components for a wide range of applications. This small outline, thin profile package offers a nominal output voltage of 3V with a tight voltage tolerance of 0.5%. With a wide operating temperature range and excellent temperature coefficient, this voltage reference ensures precise and stable performance in industrial settings. Trust Texas Instruments for unmatched value and performance in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the voltage reference, making it suitable for various operating environments.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 5 V

The 5V nominal supply voltage ensures compatibility with standard power sources, making integration into existing systems straightforward.

No. of Terminals: 3

Having 3 terminals provides stable connections and allows for precise voltage output, increasing the reliability of the voltage reference.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this voltage reference can withstand elevated temperatures, making it suitable for industrial applications.

Minimum Output Voltage: 2.985 V

The minimum output voltage of 2.985V ensures a consistent and accurate reference voltage for circuit operation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of connections.

Technology: BIPOLAR

Utilizing bipolar technology allows for precise voltage regulation and stability, making this voltage reference ideal for applications requiring accurate voltage references.

Nominal Output Voltage: 3 V

The nominal output voltage of 3V ensures a consistent reference voltage for various electronic circuits, promoting reliable and accurate performance.

Technical Specifications

Voltage References LM4040C30IDBZRG4 attributes and parameters. Explore more Voltage References devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e4

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

3.015 V

Minimum Output Voltage:

2.985 V

Nominal Output Voltage:

3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.12 mm

Sub-Category:

Voltage References

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Max Voltage Temp Coef:

100 ppm/Cel

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trim or Adjustable Output (V):

NO

Maximum Voltage Tolerance:

.5 %

Width (mm):

1.3 mm

Trade Compliance

LM4040C30IDBZRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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