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LM317HMDC

Texas Instruments

LM317HMDC by Texas Instruments

LM317HMDC by Texas Instruments is a BIPOLAR adjustable positive single output standard regulator with an operating temperature range of 0 to 125°C. It offers a min output voltage of 1.2V and a max output voltage of 37V, making it suitable for various applications requiring precise voltage regulation in surface mount configurations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,615 parts In-Stock

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5,615

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Anansix

USA . 1,344 parts In-Stock

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1,344

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Digiode

USA . 518 parts In-Stock

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518

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Distributors (Availability)

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One Stop Electronics

USA . 277 parts In-Stock

1+ parts

$0.500

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277

$0.500

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Parana Technologies

USA . 458 parts In-Stock

1+ parts

$3.180

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$3.702

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458

$3.180

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$3.702

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DigiPath Technology Company

USA . 549 parts In-Stock

1+ parts

$3.502

100+ parts

$3.221

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549

$3.502

$3.221

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ChromeModa Solutions

Germany . 5,758 parts In-Stock

1+ parts

$3.573

100+ parts

$2.930

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5,758

$3.573

$2.930

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IDEA Electronic Components Group

UK . 1,026 parts In-Stock

1+ parts

$3.573

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$3.216

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1,026

$3.573

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$3.216

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AZTECH Wire

Italy . 197 parts In-Stock

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$6.215

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197

$6.215

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Corphita

USA . 482 parts In-Stock

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482

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Overview

Unlock the power of precision and reliability with the Texas Instruments LM317HMDC Adjustable Regulator. Manufactured by a trusted industry leader, this surface mount device offers unparalleled performance for a wide range of applications. Whether you're designing a new circuit or upgrading an existing one, the LM317HMDC delivers consistent output voltage and superior thermal regulation. Trust in Texas Instruments to provide the quality and value you need to bring your projects to life.

Feature Benefit Bullets

Surface Mount: YES

The ability to be surface mounted allows for easier and more efficient integration into circuit boards, making installation and assembly processes quicker.

Operating Temperature (TJ-Max): 125 °C

With a high maximum operating temperature, this regulator is suitable for use in a wide range of applications and environments without risk of overheating.

Technology: BIPOLAR

The bipolar technology used in this regulator provides stable and accurate output regulation, ensuring consistent performance over time.

Terminal Form: NO LEAD

The lead-free terminal form is environmentally friendly and complies with regulations, making this product a more sustainable choice.

Operating Temperature (TJ-Min): 0 °C

With a low minimum operating temperature, this regulator can operate effectively in colder environments, offering versatility in usage.

Minimum Output Voltage-1: 1.2 V

The low minimum output voltage allows for precise voltage regulation, making it ideal for applications that require low power consumption.

Package Style (Meter): UNCASED CHIP

The uncased chip package style is compact and space-saving, making it suitable for applications where size constraints are important.

Regulator Type: ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR

This type of regulator offers flexibility in adjusting the output voltage, catering to a wide range of voltage requirements in different applications.

Terminal Position: UPPER

The upper terminal position makes it easy to connect and install the regulator in a circuit, simplifying the integration process.

Maximum Output Voltage-1: 37 V

The high maximum output voltage allows for powering a variety of components and devices, making this regulator versatile for different applications.

Technical Specifications

Adjustable Regulators - Positive Single Output Standard LM317HMDC attributes and parameters. Explore more Adjustable Regulators - Positive Single Output Standard devices from Texas Instruments

Specs

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

0 Cel

Maximum Output Voltage-1:

37 V

Minimum Output Voltage-1:

1.2 V

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

UNSPECIFIED

Package Style (Meter):

UNCASED CHIP

Qualification Status:

Not Qualified

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

LM317HMDC Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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