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LM20323EVAL

Texas Instruments

LM20323EVAL by Texas Instruments

LM20323EVAL by Texas Instruments is a DC/DC evaluation board with 3.3V output voltage and 3A output current, suitable for step-down applications. Operating at 500kHz switching frequency, it accepts input voltages from 4.5V to 25V, utilizing the LM20323 IC in a Buck regulator topology for non-isolated power conversion.

Median Price

$57.350

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2 parts In-Stock

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$57.350

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$57.350

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Digiode

USA . 2,657 parts In-Stock

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$54.482

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Vyrian

USA . 5,055 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2 parts In-Stock

1+ parts

$48.750

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$48.750

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Semicontronic

India . 2 parts In-Stock

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$48.750

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$47.531

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$47.288

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2

$48.750

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Corphita

USA . 2,777 parts In-Stock

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$51.615

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Corohmni

South Africa . 274 parts In-Stock

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$57.350

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DigiPath Technology Company

USA . 1,938 parts In-Stock

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IDEA Electronic Components Group

UK . 1,539 parts In-Stock

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ChromeModa Solutions

Germany . 696 parts In-Stock

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Parana Technologies

USA . 693 parts In-Stock

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$0.530

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Overview

Experience the cutting-edge technology of Texas Instruments with the LM20323EVAL Evaluation Board. Designed for DC/DC Step Down applications, this board offers a non-isolated 3.3V output with a 3A current capacity. With a Buck regulator topology and a switching frequency of 500kHz, this fully populated board is perfect for testing and evaluating power supply solutions. Trust in Texas Instruments' reputation for quality and innovation, and unlock the potential of your projects with the LM20323EVAL.

Feature Benefit Bullets

Main Purpose: DC/DC, Step Down

This board is specifically designed for DC/DC step down conversions, ensuring efficient power supply for various electronic devices.

Voltage - Output: 3.3V

Provides a stable output voltage of 3.3V, which is commonly used in many electronic applications.

Current - Output: 3A

Capable of delivering a high output current of 3A, making it suitable for powering devices that require higher power consumption.

Voltage - Input: 4.5V ~ 25V

Wide input voltage range of 4.5V to 25V allows flexibility in power source selection, making it versatile for different applications.

Regulator Topology: Buck

Buck regulator topology is known for high efficiency in step-down voltage conversion, making this board an energy-efficient choice.

Frequency - Switching: 500kHz

Operates at a high switching frequency of 500kHz, providing smooth and ripple-free power output for sensitive electronic components.

Utilized IC / Part: LM20323

The LM20323 integrated circuit is known for its reliability and performance in DC/DC power supply applications, ensuring stable and regulated output.

Technical Specifications

Additional Parts LM20323EVAL attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Main Purpose:

DC/DC, Step Down

Category:

Development Boards, Kits, Programmers
Evaluation Boards DC/DC & AC/DC (Off-Line) SMPS Evaluation Boards

Current - Output:

3A

Standard Package:

1

Regulator Topology:

Buck

Frequency - Switching:

500kHz

Supplied Contents:

Board(s)

Voltage - Output:

3.3V

Board Type:

Fully Populated

Outputs and Type:

1, Non-Isolated

Utilized IC / Part:

LM20323

Package:

Box

Voltage - Input:

4.5V ~ 25V

Base Product Number:

LM20323

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

LM20323EVAL Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

9030.90.6600

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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