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LM135H-MLS

Texas Instruments

LM135H-MLS by Texas Instruments

LM135H-MLS by Texas Instruments is a temperature sensor with a voltage output. It operates b/w -55°C to 150°C, with a max output voltage of 0.002V and current of 5mA. This metal-housed sensor is ideal for applications requiring precise temperature monitoring in various industries.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,952 parts In-Stock

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Digiode

USA . 4,200 parts In-Stock

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Anansix

USA . 1,899 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 358 parts In-Stock

1+ parts

$2.074

100+ parts

$192.574

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$1.866

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358

$2.074

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$1.866

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DigiPath Technology Company

USA . 1,228 parts In-Stock

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$2.283

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$2.101

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$2.283

$2.101

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ChromeModa Solutions

Germany . 361 parts In-Stock

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$2.330

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$1.911

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361

$2.330

$1.911

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IDEA Electronic Components Group

UK . 262 parts In-Stock

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$2.330

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$2.097

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262

$2.330

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AZTECH Wire

Italy . 888 parts In-Stock

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$18.079

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One Stop Electronics

USA . 822 parts In-Stock

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$45.750

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Corphita

USA . 3,714 parts In-Stock

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Kepictronics

USA . 120 parts In-Stock

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Overview

Elevate your temperature sensing capabilities with the LM135H-MLS by Texas Instruments. As a leader in quality manufacturing, Texas Instruments delivers reliable and precise temperature sensors for a variety of applications. Whether you're monitoring industrial processes or ensuring optimal performance in consumer electronics, the LM135H-MLS offers unparalleled value, accuracy, and efficiency. Trust in Texas Instruments to provide innovative solutions that meet your temperature sensing needs with excellence.

Feature Benefit Bullets

Sensors or Transducers Type: TEMPERATURE SENSOR, ANALOG, VOLTAGE OUTPUT

Analog voltage output allows for easy interfacing with various control systems and microcontrollers.

Body Height: 2.34 mm

Low profile design enables easy integration into compact spaces or devices.

Package Shape or Style: ROUND

Round shape allows for easy installation and placement in various applications.

Maximum Operating Temperature: 150 °C

High operating temperature range makes this sensor suitable for a wide range of industrial and commercial applications.

Minimum Operating Temperature: -55 °C

Wide range of minimum operating temperature ensures accurate temperature sensing even in extreme cold conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and reliability in electrical connections.

Maximum Output Voltage: 0.002 V

Low output voltage simplifies signal processing and reduces the need for complex voltage regulation circuitry.

Maximum Operating Current: 5 mA

Low operating current minimizes power consumption and makes this sensor energy-efficient.

Housing: METAL

Metal housing provides durability and protection for the sensor, ensuring long-term reliability in harsh environments.

Body Length/Diameter: 4.73 mm

Compact body size allows for easy installation and integration in space-constrained applications.

Termination Type: SOLDER

Solder termination allows for secure and reliable electrical connections during installation.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature offers easy and secure attachment to PCBs or other mounting surfaces.

Technical Specifications

Temperature Sensors LM135H-MLS attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Maximum Accuracy (Cel):

1

Body Height:

2.34 mm

Body Length/Diameter:

4.73 mm

Housing:

METAL

JESD-609 Code:

e0

Mounting Feature:

Maximum Operating Current:

5 mA

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Voltage:

.002 V

Package Shape or Style:

Sensors or Transducers Type:

Terminal Finish:

Tin/Lead (Sn/Pb)

Termination Type:

SOLDER

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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