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IWR6843ABGABL

Texas Instruments

IWR6843ABGABL by Texas Instruments

The Texas Instruments IWR6843ABGABL is a MMWAVE RADAR SENSOR MODULE with 161 terminals. It operates b/w -40 to 105°C, outputting a digital voltage range of 0.45-1.35V in an open-drain configuration. This RFCMOS technology sensor is designed for surface mount applications in various industries.

Median Price

$29.436

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 17,052 parts In-Stock

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$29.436

100+ parts

$26.165

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$19.239

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17,052

$29.436

$26.165

$19.239

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Mouser Electronics

USA . 135 parts In-Stock

1+ parts

$47.460

100+ parts

$33.910

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$32.560

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135

$47.460

$33.910

$32.560

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Chip1Stop

Japan . 1,894 parts In-Stock

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$24.670

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1,894

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$24.670

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Distributors (In-Stock)

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Digiode

USA . 2,433 parts In-Stock

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$27.964

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2,433

$27.964

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Nova Conductors

Japan . 500 parts In-Stock

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$28.859

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$28.859

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Vyrian

USA . 6,081 parts In-Stock

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Chip Stock

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SPM Sales

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Distributors (Availability)

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Parana Technologies

USA . 1,476 parts In-Stock

1+ parts

$1.430

100+ parts

-

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$2.125

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1,476

$1.430

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$2.125

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DigiPath Technology Company

USA . 44 parts In-Stock

1+ parts

$1.575

100+ parts

$1.449

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44

$1.575

$1.449

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ChromeModa Solutions

Germany . 6,184 parts In-Stock

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$1.607

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$1.318

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$1.607

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IDEA Electronic Components Group

UK . 1,995 parts In-Stock

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$1.607

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$1.446

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$1.607

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Corohmni

South Africa . 656 parts In-Stock

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$1.764

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$1.764

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Ampacity Inc.

Singapore . 6,072 parts In-Stock

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$20.970

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Corphita

USA . 4,513 parts In-Stock

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$26.492

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Continental Prestige Electronics

USA . 263 parts In-Stock

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$28.859

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$28.281

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$28.281

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Argo Parts USA

USA . 1,193 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$28.281

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$27.416

10k+ parts

$26.838

500

-

$28.281

$27.416

$26.838

Overview

Unlock the power of cutting-edge technology with the IWR6843ABGABL by Texas Instruments. This MMWAVE RADAR SENSOR MODULE offers unmatched quality and precision, setting the standard for innovation in the industry. Whether you're looking to revolutionize automotive safety systems or enhance industrial automation, this sensor module delivers unparalleled performance. With a wide range of applications and top-notch reliability, the IWR6843ABGABL provides customers with exceptional value and peace of mind. Trust Texas Instruments to deliver the best in sensor technology for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the sensor module suitable for various environmental conditions.

Maximum Supply Voltage: 1.32 V

The higher supply voltage allows for accurate and efficient performance of the radar sensor module.

Body Width: 10.4 inch

With a wide body width, the sensor module offers a larger detection range and coverage area.

Sensors or Transducers Type: MMWAVE RADAR SENSOR MODULE

Utilizing mmWave technology allows for precise sensing capabilities, ideal for applications requiring high accuracy.

No. of Terminals: 161

The numerous terminals provide flexibility in connections and integrate various functionalities within the radar sensor module.

Body Height: 0.8 mm

The low body height offers a compact and slim profile, making it suitable for space-constrained applications.

Package Shape or Style: SQUARE

The square shape allows for easy integration into existing systems and compact placement on circuit boards.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures efficient power usage and prolongs the sensor module's lifespan.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the sensor module can withstand harsh conditions and extreme temperatures.

Output Range: 0.45-1.35V

The wide output range provides versatility in detecting different signal strengths and distances accurately.

Output Type: DIGITAL VOLTAGE

The digital voltage output simplifies signal processing and integration with digital systems.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the sensor module to function reliably even in cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper enhances conductivity and ensures a secure connection for stable performance.

Output (V): OPEN-DRAIN

The open-drain output configuration permits easy interfacing with various microcontrollers and signal processing units.

Technology: RFCMOS

The RFCMOS technology offers a combination of high-frequency capabilities and low power consumption for efficient sensor operation.

Body Length/Diameter: 10.4 mm

The compact body size makes the sensor module easy to install and integrate into different applications.

Mounting Feature: SURFACE MOUNT

The surface mount feature simplifies the installation process and allows for secure attachment to circuit boards.

Technical Specifications

Other Function Sensors & Transducers IWR6843ABGABL attributes and parameters. Explore more Other Function Sensors & Transducers devices from Texas Instruments

Specs

Body Width:

10.4 inch

Body Height:

.8 mm

Body Length/Diameter:

10.4 mm

Mounting Feature:

No. of Terminals:

161

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

OPEN-DRAIN

Output Range:

Output Type:

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA161,15X15,26

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Technology:

RFCMOS

Terminal Finish:

TIN SILVER COPPER

Trade Compliance

IWR6843ABGABL Sensors & Transducers trade compliance attributes, and parameters.

ECCN

5A991.B.6.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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