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INA301A3QDGKRQ1

Texas Instruments

INA301A3QDGKRQ1 by Texas Instruments

Texas Instruments' INA301A3QDGKRQ1 is a comparator with 35uV max input offset voltage, 36V max common mode voltage, and 125°C max operating temp. Ideal for automotive applications due to AEC-Q100 screening level and open-drain output type.

Median Price

$1.734

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,420 parts In-Stock

1+ parts

$1.730

100+ parts

$1.590

1k+ parts

$1.530

10k+ parts

-

2,420

$1.730

$1.590

$1.530

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Arrow

USA . 1,102 parts In-Stock

1+ parts

$1.738

100+ parts

$1.623

1k+ parts

$1.593

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-

1,102

$1.738

$1.623

$1.593

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Texas Instruments

USA . 41,868 parts In-Stock

1+ parts

$2.359

100+ parts

$2.067

1k+ parts

$1.168

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-

41,868

$2.359

$2.067

$1.168

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Verical

USA . 1,102 parts In-Stock

1+ parts

-

100+ parts

$1.623

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$1.593

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1,102

-

$1.623

$1.593

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.425

100+ parts

-

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100

$1.425

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Digiode

USA . 1,400 parts In-Stock

1+ parts

$1.530

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1,400

$1.530

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Chip Stock

USA . 23,280 parts In-Stock

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23,280

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Vyrian

USA . 2,892 parts In-Stock

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2,892

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Distributors (Availability)

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Semicontronic

India . 11,296 parts In-Stock

1+ parts

$1.360

100+ parts

$1.326

1k+ parts

$1.319

10k+ parts

-

11,296

$1.360

$1.326

$1.319

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Ampacity Inc.

Singapore . 11,416 parts In-Stock

1+ parts

$1.390

100+ parts

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11,416

$1.390

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Continental Prestige Electronics

USA . 5,506 parts In-Stock

1+ parts

$1.425

100+ parts

-

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10k+ parts

$1.396

5,506

$1.425

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-

$1.396

Argo Parts USA

USA . 2,083 parts In-Stock

1+ parts

$1.425

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2,083

$1.425

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.425

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1,000

$1.425

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Corphita

USA . 4,388 parts In-Stock

1+ parts

$1.449

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4,388

$1.449

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Corohmni

South Africa . 47 parts In-Stock

1+ parts

$1.826

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47

$1.826

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$2.102

100+ parts

$1.934

1k+ parts

$1.812

10k+ parts

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2,000

$2.102

$1.934

$1.812

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Parana Technologies

USA . 456 parts In-Stock

1+ parts

$6.418

100+ parts

$595.989

1k+ parts

$5.776

10k+ parts

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456

$6.418

$595.989

$5.776

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DigiPath Technology Company

USA . 1,959 parts In-Stock

1+ parts

$7.067

100+ parts

$6.501

1k+ parts

-

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1,959

$7.067

$6.501

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ChromeModa Solutions

Germany . 4,468 parts In-Stock

1+ parts

$7.211

100+ parts

$5.913

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4,468

$7.211

$5.913

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IDEA Electronic Components Group

UK . 2,171 parts In-Stock

1+ parts

$7.211

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1k+ parts

$6.490

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2,171

$7.211

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$6.490

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AZTECH Wire

Italy . 1,160 parts In-Stock

1+ parts

$16.360

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1,160

$16.360

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Overview

Experience unmatched performance and reliability with the INA301A3QDGKRQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality comparators like this one, perfect for a wide range of applications. Whether you're in the automotive sector or working on industrial projects, this product offers exceptional value with its high precision and fast response time. Trust in Texas Instruments to provide cutting-edge technology that will elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Maximum Input Offset Voltage: 35 uV

The low input offset voltage ensures accurate and precise comparison results.

Surface Mount: YES

Allows for easy integration onto PCBs, saving space and facilitating automated assembly processes.

Screening Level: AEC-Q100

AEC-Q100 compliance ensures reliability and durability for automotive applications.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a common supply voltage of 5V.

No. of Terminals: 8

Sufficient terminals for connecting to external circuits and peripherals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the PCB and allows for high-density mounting.

Maximum Supply Voltage Limit: 6 V

Safe operating range up to 6V ensures protection against voltage spikes.

Maximum Operating Temperature: 125 °C

Can withstand high-temperature environments, making it suitable for automotive applications.

Maximum Common Mode Voltage: 36 V

Wide common-mode voltage range allows for flexibility in different operating conditions.

Output Type: OPEN-DRAIN

Open-drain output configuration enhances flexibility and compatibility with different logic levels.

Nominal Response Time: 750 ns

Fast response time enables quick signal processing and decision-making.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low-temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit board layout.

Maximum Seated Height: 1.1 mm

Low-profile design saves space in compact electronic devices.

Width: 3 mm

Compact width facilitates high-density mounting on PCBs.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and component integrity during assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for lead-free soldering processes.

Length: 3 mm

Compact length for space-saving design.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications with stringent temperature requirements.

Minimum Common Mode Reject Ratio: 100 dB

High common mode rejection ratio ensures accurate and reliable signal processing.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure connections.

Amplifier Type: COMPARATOR

Comparator functionality for accurate voltage comparison in various applications.

Maximum Supply Current: 0.7 mA

Low supply current consumption for energy-efficient operation.

Packing Method: TR

Tape and reel packing method for easy handling and automated assembly.

Nominal Slow Rate: 4 V/us

Nominal slow rate enables gradual voltage changes for stable operation.

Terminal Pitch: 0.65 mm

Narrow terminal pitch for high-density mounting on PCBs.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates moderate sensitivity to moisture, suitable for standard handling and storage conditions.

Technical Specifications

Comparators INA301A3QDGKRQ1 attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Comparators

Output Type:

Open-Drain

Performance Specifications

Nominal Slew Rate:

4 V/us

Minimum Common Mode Reject Ratio:

100 dB

Maximum Input Offset Voltage:

35 uV

Maximum Common Mode Voltage:

36 V

Operational Characteristics

Maximum Supply Current:

700 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

750 ns

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold Silver

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Screening Level:

AEC-Q100

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Type:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

INA301A3QDGKRQ1 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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