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INA282AQDRDN

Texas Instruments

INA282AQDRDN by Texas Instruments

Texas Instruments' INA282AQDRDN is an AEC-Q100 compliant operational amplifier with 8 terminals in a small outline package. Featuring nickel palladium gold terminal finish, it has a max seated height of 1.75mm and operates at peak reflow temperature of 260°C. Ideal for automotive applications due to its gull wing terminal form and moisture sensitivity level of 2.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,873 parts In-Stock

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Digiode

USA . 856 parts In-Stock

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856

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Distributors (Availability)

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Parana Technologies

USA . 338 parts In-Stock

1+ parts

$3.070

100+ parts

-

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$3.585

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338

$3.070

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$3.585

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IDEA Electronic Components Group

UK . 1,928 parts In-Stock

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$3.449

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$3.104

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1,928

$3.449

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ChromeModa Solutions

Germany . 306 parts In-Stock

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$3.449

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$2.828

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306

$3.449

$2.828

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One Stop Electronics

USA . 908 parts In-Stock

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$9.410

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908

$9.410

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AZTECH Wire

Italy . 345 parts In-Stock

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$19.814

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345

$19.814

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A-Z Elektronik GmbH

Germany . 9,161 parts In-Stock

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Kepictronics

USA . 4,245 parts In-Stock

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DigiPath Technology Company

USA . 1,201 parts In-Stock

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$3.110

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$3.110

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Alle Elektronik GmbH

Germany . 1,107 parts In-Stock

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Microchip USA

USA . 1,043 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

USA . 466 parts In-Stock

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Overview

Elevate your projects with the Texas Instruments INA282AQDRDN operational amplifier. Designed with precision and durability in mind, this high-quality component boasts a package body material of plastic/epoxy and a terminal finish of nickel palladium gold. Perfect for automotive applications, this amplifier offers reliability and performance that will exceed your expectations. Trust Texas Instruments to deliver cutting-edge technology that will take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for automotive applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easy assembly onto circuit boards, making the product suitable for automated manufacturing processes.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures the product's reliability and performance in automotive environments where high temperature and vibration resistance are required.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of board space and easy integration into compact automotive electronic systems.

No. of Terminals: 8

Having 8 terminals provides multiple connection points for various input and output signals, making the product versatile and suitable for complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables the product to be used in space-constrained automotive applications without compromising on performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures excellent conductivity and corrosion resistance, enhancing the product's longevity and reliability.

Terminal Position: DUAL

Dual terminal position provides additional flexibility in circuit connection, allowing for different routing options and ease of integration.

Maximum Seated Height: 1.75 mm

Low maximum seated height allows for a more compact design, making the product suitable for applications where space constraints are a concern.

Width: 3.9 mm

Compact width dimensions enable the product to be used in tight spaces, ensuring easy integration into automotive electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, the product can withstand manufacturing processes without affecting its performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures the product's reliability and stability during manufacturing and operation in high-temperature automotive environments.

Length: 4.9 mm

The compact length of the product allows for efficient use of space on circuit boards, making it ideal for small automotive electronic systems.

Temperature Grade: AUTOMOTIVE

Designed for automotive temperature requirements, the product can operate reliably under extreme temperature conditions typically found in automotive applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, reducing the risk of solder joint failure in automotive environments with temperature variations.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier type, the product offers high precision and performance, making it suitable for automotive applications requiring accurate signal processing.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for efficient routing of signals on circuit boards, contributing to better signal integrity and performance of the product.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates that the product is moderately sensitive to moisture, making it suitable for automotive environments with moderate humidity levels.

Technical Specifications

Operational Amplifiers (Op Amps) INA282AQDRDN attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Screening Level:

AEC-Q100

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

INA282AQDRDN Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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