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INA210AIDCKTG4

Texas Instruments

INA210AIDCKTG4 by Texas Instruments

Texas Instruments' INA210AIDCKTG4 is a small outline, thin profile operational amplifier with 6 terminals. It features a rectangular package shape made of plastic/epoxy and matte tin terminal finish. Ideal for automotive applications due to its dual terminal position and compact dimensions (2mm x 1.25mm x 1.1mm).

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 67,980 parts In-Stock

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Vyrian

USA . 3,996 parts In-Stock

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3,996

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Digiode

USA . 2,372 parts In-Stock

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2,372

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Connector Distribution Corp

USA . 170 parts In-Stock

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170

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Right Parts Inc.

USA . 170 parts In-Stock

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170

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Nova Conductors

Japan . 32 parts In-Stock

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32

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Distributors (Availability)

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Corohmni

South Africa . 125 parts In-Stock

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$3.546

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125

$3.546

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Parana Technologies

USA . 1,475 parts In-Stock

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$3.634

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$4.144

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1,475

$3.634

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$4.144

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DigiPath Technology Company

USA . 467 parts In-Stock

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$4.001

100+ parts

$3.681

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467

$4.001

$3.681

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ChromeModa Solutions

Germany . 1,345 parts In-Stock

1+ parts

$4.083

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$3.348

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$4.083

$3.348

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IDEA Electronic Components Group

UK . 64 parts In-Stock

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$4.083

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$3.675

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64

$4.083

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$3.675

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Semicontronic

India . 390 parts In-Stock

1+ parts

$7.410

100+ parts

$7.225

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$7.188

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390

$7.410

$7.225

$7.188

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One Stop Electronics

USA . 1,434 parts In-Stock

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$8.410

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1,434

$8.410

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Ampacity Inc.

Singapore . 1,432 parts In-Stock

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$9.410

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$9.410

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AZTECH Wire

Italy . 805 parts In-Stock

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$18.814

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805

$18.814

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Component Stockers USA

USA . 573 parts In-Stock

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$99.990

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573

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Continental Prestige Electronics

USA . 5,678 parts In-Stock

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Argo Parts USA

USA . 4,396 parts In-Stock

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Corphita

USA . 2,004 parts In-Stock

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Microchip USA

USA . 1,892 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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500

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Perfect Parts

USA . 280 parts In-Stock

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280

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Modulus Dynamics

Lithuania . 100 parts In-Stock

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100

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Experience the ultimate in precision and performance with the Texas Instruments INA210AIDCKTG4. As a leader in operational amplifiers, Texas Instruments delivers unparalleled quality and reliability in every product. The INA210AIDCKTG4 is designed for a wide range of applications, providing customers with superior value and benefits. Trust in Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the exceptional performance of the INA210AIDCKTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product ideal for mobile or compact applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and space in the overall design.

No. of Terminals: 6

Having 6 terminals provides flexibility in connecting external components, making the product versatile for various circuit configurations.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliability and performance in harsh operating conditions such as temperature variations.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this product is suitable for precision applications where high gain and accurate signal processing are required.

Technical Specifications

Operational Amplifiers (Op Amps) INA210AIDCKTG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.079 in (2 mm)

Width:

0.049 in (1.25 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

6

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

INA210AIDCKTG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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