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INA210AIDCKRG4

Texas Instruments

INA210AIDCKRG4 by Texas Instruments

INA210AIDCKRG4 by Texas Instruments is a small outline, thin profile operational amplifier with 6 terminals. It has a max seated height of 1.1 mm and a width of 1.25 mm. This automotive-grade amplifier is suitable for applications requiring precise amplification in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 78,500 parts In-Stock

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78,500

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Vyrian

USA . 7,857 parts In-Stock

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7,857

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Digiode

USA . 377 parts In-Stock

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377

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Distributors (Availability)

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One Stop Electronics

USA . 1,355 parts In-Stock

1+ parts

$1.410

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1,355

$1.410

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Parana Technologies

USA . 909 parts In-Stock

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$1.413

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-

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$2.113

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909

$1.413

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$2.113

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DigiPath Technology Company

USA . 482 parts In-Stock

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$1.556

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$1.432

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482

$1.556

$1.432

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ChromeModa Solutions

Germany . 2,189 parts In-Stock

1+ parts

$1.588

100+ parts

$1.302

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2,189

$1.588

$1.302

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IDEA Electronic Components Group

UK . 1,502 parts In-Stock

1+ parts

$1.588

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-

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$1.429

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1,502

$1.588

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$1.429

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Semicontronic

India . 975 parts In-Stock

1+ parts

$3.410

100+ parts

$3.325

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$3.308

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975

$3.410

$3.325

$3.308

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Corohmni

South Africa . 481 parts In-Stock

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$5.981

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481

$5.981

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Ampacity Inc.

Singapore . 267 parts In-Stock

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$6.410

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267

$6.410

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AZTECH Wire

Italy . 484 parts In-Stock

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$7.017

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484

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Kepictronics

USA . 16,700 parts In-Stock

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Lixinc

USA . 15,576 parts In-Stock

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A-Z Elektronik GmbH

Germany . 13,905 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 4,659 parts In-Stock

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4,659

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Argo Parts USA

USA . 3,147 parts In-Stock

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Microchip USA

USA . 2,715 parts In-Stock

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Perfect Parts

USA . 672 parts In-Stock

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672

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Continental Prestige Electronics

USA . 179 parts In-Stock

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179

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Robosynatics

Brazil . 150 parts In-Stock

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150

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Lucentia Tech

USA . 150 parts In-Stock

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$53.175

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$53.175

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$53.175

150

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$53.175

$53.175

$53.175

Advanced Electronics

New Zealand . 15 parts In-Stock

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15

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Looking for a reliable and high-quality operational amplifier? Look no further than the INA210AIDCKRG4 by Texas Instruments. With its exceptional manufacturing standards, Texas Instruments is renowned for delivering top-notch products that meet the needs of various applications. But what sets this op amp apart? Its compact size, versatile terminal position, and automotive-grade temperature grade make it perfect for your projects. Experience the value and benefits of the INA210AIDCKRG4, and take your designs to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the operational amplifier, ensuring reliable performance in different environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on printed circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to handle and integrate into a circuit design, providing versatility in installation options.

No. of Terminals: 6

Having 6 terminals allows for multiple connection points, offering flexibility in circuit design and functionality.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability, ensuring secure and reliable connections during assembly.

Maximum Seated Height: 1.1 mm

The low profile of the operational amplifier allows for compact designs and saves space in electronic devices.

Width: 1.25 mm

The small width contributes to the overall compactness of the component, making it suitable for applications where space is limited.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures that the operational amplifier can withstand reflow soldering processes without damage, simplifying the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering processes and ensures the operational amplifier's stability under various thermal conditions.

Length: 2 mm

The compact length of the operational amplifier further contributes to space-saving designs and versatility in different electronic applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this operational amplifier meets the required industry standards for reliability and performance in harsh operating conditions.

Terminal Form: GULL WING

The gull wing terminal form offers secure connections and makes it easier to handle during assembly, ensuring proper alignment and contact with the PCB.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this product is suitable for a wide range of analog signal processing applications, providing high gain and accuracy in amplifying signals.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for close placement of terminals, enabling high-density circuit designs and efficient routing of connections.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, this operational amplifier can withstand low to moderate humidity levels, ensuring long-term reliability and performance in various environments.

Technical Specifications

Operational Amplifiers (Op Amps) INA210AIDCKRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.079 in (2 mm)

Width:

0.049 in (1.25 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

6

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

INA210AIDCKRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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