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INA199B1DCKT

Texas Instruments

INA199B1DCKT by Texas Instruments

INA199B1DCKT by Texas Instruments is a Power Management IC with 6 terminals, operating from -40 to 125 °C. It supports supply voltages from 2.7V to 26V and has a max supply current of 5mA. Ideal for automotive applications due to its small outline package and dual terminal position.

Median Price

$1.042

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 254,479 parts In-Stock

1+ parts

$0.953

100+ parts

$0.733

1k+ parts

$0.386

10k+ parts

-

254,479

$0.953

$0.733

$0.386

-

DigiKey

USA . 37,048 parts In-Stock

1+ parts

$1.130

100+ parts

$0.652

1k+ parts

$0.574

10k+ parts

$0.528

37,048

$1.130

$0.652

$0.574

$0.528

Mouser Electronics

USA . 11,103 parts In-Stock

1+ parts

$1.130

100+ parts

$0.653

1k+ parts

$0.552

10k+ parts

$0.527

11,103

$1.130

$0.653

$0.552

$0.527

Arrow

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.472

10k+ parts

-

250

-

-

$0.472

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,026 parts In-Stock

1+ parts

$0.501

100+ parts

-

1k+ parts

-

10k+ parts

-

4,026

$0.501

-

-

-

Digiode

USA . 1,720 parts In-Stock

1+ parts

$0.855

100+ parts

-

1k+ parts

-

10k+ parts

-

1,720

$0.855

-

-

-

Chip Stock

USA . 89,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

89,500

-

-

-

-

IBS Electronics

USA . 50,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50,000

-

-

-

-

AGACORP

USA . 1,696 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,696

-

-

-

-

Bristol Electronics

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,220 parts In-Stock

1+ parts

$0.810

100+ parts

-

1k+ parts

-

10k+ parts

-

4,220

$0.810

-

-

-

Component Stockers USA

USA . 73,650 parts In-Stock

1+ parts

$1.250

100+ parts

$0.810

1k+ parts

$0.560

10k+ parts

$0.480

73,650

$1.250

$0.810

$0.560

$0.480

Parana Technologies

USA . 1,285 parts In-Stock

1+ parts

$3.505

100+ parts

-

1k+ parts

$4.030

10k+ parts

-

1,285

$3.505

-

$4.030

-

DigiPath Technology Company

USA . 1,903 parts In-Stock

1+ parts

$3.859

100+ parts

$3.551

1k+ parts

-

10k+ parts

-

1,903

$3.859

$3.551

-

-

ChromeModa Solutions

Germany . 5,647 parts In-Stock

1+ parts

$3.938

100+ parts

$3.229

1k+ parts

-

10k+ parts

-

5,647

$3.938

$3.229

-

-

IDEA Electronic Components Group

UK . 2,184 parts In-Stock

1+ parts

$3.938

100+ parts

-

1k+ parts

$3.544

10k+ parts

-

2,184

$3.938

-

$3.544

-

QUARKTWIN TECHNOLOGY LTD

USA . 17,956 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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17,956

-

-

-

-

Lixinc

USA . 10,373 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,373

-

-

-

-

Overview

Discover the power of the INA199B1DCKT by Texas Instruments, a top-of-the-line Power Management IC that offers unparalleled quality and reliability. Manufactured with precision and expertise, this small outline, thin profile chip is perfect for a wide range of applications in the automotive industry. With a nominal supply voltage of 5V, dual terminals, and matte tin finish, this IC provides optimal performance and efficiency. Trust Texas Instruments to deliver cutting-edge solutions that enhance your products' functionality and value. Upgrade your power management system today with the INA199B1DCKT and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and robustness of the package, making it suitable for various applications.

Nominal Supply Voltage (Vsup): 5 V

With a stable nominal supply voltage of 5V, this product can be easily integrated into systems with standard power requirements.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows this power management IC to be used in harsh environments without risk of overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that this IC functions reliably even in extreme cold conditions.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, this IC is less susceptible to moisture-related damage during handling and storage.

Maximum Supply Current (Isup): 5 mA

The low maximum supply current of 5mA indicates efficient power consumption, making this IC ideal for energy-efficient applications.

Technical Specifications

Power Management ICs INA199B1DCKT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

26 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.25 mm

Trade Compliance

INA199B1DCKT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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