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HDC2010YPAT

Texas Instruments

HDC2010YPAT by Texas Instruments

HDC2010YPAT by Texas Instruments is a 14-bit temperature sensor with I2C interface. It operates b/w -40 to 85°C, consuming up to 0.73mA at max voltage of 3.6V. Ideal for applications requiring precise temperature monitoring in compact spaces due to its small 0.675mm body height and surface mounting feature.

Median Price

$2.214

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,187 parts In-Stock

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-

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$1.740

10k+ parts

$1.590

1,187

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$1.740

$1.590

Farnell

UK . 39 parts In-Stock

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$2.689

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$2.689

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Distributors (In-Stock)

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Nova Conductors

Japan . 52 parts In-Stock

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$1.821

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52

$1.821

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Ozdisan Elektronik

Türkiye . 500 parts In-Stock

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$2.070

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500

$2.070

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Digiode

USA . 2,845 parts In-Stock

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$2.679

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$2.679

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Chip Stock

USA . 102,500 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,988 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,250 parts In-Stock

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ComSIT USA

USA . 2,250 parts In-Stock

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NAC Semi

USA . 650 parts In-Stock

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$1.460

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$1.460

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Vyrian

USA . 161 parts In-Stock

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Elcom Components

USA . 29 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 328 parts In-Stock

1+ parts

$1.480

100+ parts

$1.443

1k+ parts

$1.436

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328

$1.480

$1.443

$1.436

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Ampacity Inc.

Singapore . 57 parts In-Stock

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$1.480

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$1.480

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Aranea Global

USA . 100 parts In-Stock

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$1.785

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$1.713

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$1.785

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$1.713

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Argo Parts USA

USA . 92 parts In-Stock

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$1.803

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$1.803

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Corohmni

South Africa . 726 parts In-Stock

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$1.923

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726

$1.923

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Advanced Electronics

New Zealand . 42 parts In-Stock

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$1.981

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$1.882

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$1.882

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42

$1.981

$1.882

$1.882

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Parana Technologies

USA . 1,953 parts In-Stock

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$2.513

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$3.001

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$2.513

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Corphita

USA . 1,597 parts In-Stock

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$2.538

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DigiPath Technology Company

USA . 336 parts In-Stock

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$2.768

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$2.546

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336

$2.768

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ChromeModa Solutions

Germany . 4,850 parts In-Stock

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$2.824

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$2.316

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$2.824

$2.316

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IDEA Electronic Components Group

UK . 93 parts In-Stock

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$2.824

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$2.542

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Lixinc

USA . 5,443 parts In-Stock

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Perfect Parts

USA . 2,240 parts In-Stock

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Continental Prestige Electronics

USA . 493 parts In-Stock

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$1.770

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$1.560

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$1.770

$1.560

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Overview

Experience precise temperature sensing like never before with the HDC2010YPAT by Texas Instruments. Crafted with superior quality and expertise, this temperature sensor offers unmatched accuracy and reliability for a wide range of applications. Whether you're monitoring environmental conditions or controlling industrial processes, this sensor provides valuable data with minimal power consumption. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations and unlocks new possibilities. Elevate your projects with the HDC2010YPAT and discover the difference today.

Feature Benefit Bullets

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this temperature sensor can operate effectively even in systems with higher voltage requirements.

No. of Bits: 14

Having 14 bits of resolution allows for precise temperature measurements and more accurate readings.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

This sensor offers multiple functionalities, making it versatile and suitable for various applications where temperature monitoring and control are required.

Body Height: 0.675 mm

The small body height makes this sensor compact and suitable for applications where space is limited.

Package Shape or Style: SQUARE

The square package shape provides ease of mounting and integration into systems.

Minimum Supply Voltage: 1.62 V

With a low minimum supply voltage requirement, this sensor can operate efficiently in low power systems or battery-operated devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows this sensor to be used in both extreme hot and cold environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range makes this sensor suitable for applications in cold temperature environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides good conductivity and corrosion resistance, ensuring reliable performance over time.

Maximum Operating Current: 0.73 mA

With a low maximum operating current, this sensor consumes minimal power, making it energy-efficient.

Maximum Accuracy °C: 0.40

The high accuracy of 0.40°C ensures precise temperature measurements, making this sensor reliable for critical temperature control applications.

Termination Type: SOLDER

The solder termination type makes it easy to install and secure connections for stable operation.

Output Interface Type: I2C INTERFACE

The I2C interface allows for easy communication with other devices, enabling seamless integration into digital systems.

Mounting Feature: SURFACE MOUNT

The surface mount feature facilitates easy installation and integration onto PCBs or other surfaces, saving space and simplifying assembly.

Technical Specifications

Temperature Sensors HDC2010YPAT attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Maximum Accuracy (Cel):

0.40

Body Height:

.675 mm

JESD-609 Code:

e1

Mounting Feature:

No. of Bits:

14

Maximum Operating Current:

.73 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Interface Type:

I2C INTERFACE

Package Shape or Style:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Terminal Finish:

TIN SILVER COPPER

Termination Type:

SOLDER

Trade Compliance

HDC2010YPAT Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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