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FW427IPMR-ACTA

Texas Instruments

FW427IPMR-ACTA by Texas Instruments

Texas Instruments FW427IPMR-ACTA is a 16-bit microcontroller with MSP430 CPU family, 64 terminals, and 32768 ROM words. It operates b/w -40 to 85 °C, has peripherals like BOD and LCD, and supports up to 8 MHz clock frequency. Ideal for industrial applications requiring low profile design and high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,714 parts In-Stock

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4,714

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Digiode

USA . 2,592 parts In-Stock

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2,592

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Distributors (Availability)

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Native Components

USA . 910 parts In-Stock

1+ parts

$0.188

100+ parts

-

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$0.181

910

$0.188

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$0.181

Northwest PG Solutions

USA . 1,794 parts In-Stock

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$0.207

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-

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$0.182

1,794

$0.207

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$0.182

AZTECH Wire

Italy . 391 parts In-Stock

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$5.965

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391

$5.965

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Parana Technologies

USA . 1,125 parts In-Stock

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$20.181

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$20.140

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1,125

$20.181

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$20.140

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One Stop Electronics

USA . 153 parts In-Stock

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$22.000

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153

$22.000

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ChromeModa Solutions

Germany . 4,058 parts In-Stock

1+ parts

$22.675

100+ parts

$18.594

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4,058

$22.675

$18.594

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IDEA Electronic Components Group

UK . 98 parts In-Stock

1+ parts

$22.675

100+ parts

$21.541

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$20.408

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98

$22.675

$21.541

$20.408

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Corphita

USA . 1,822 parts In-Stock

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1,822

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DigiPath Technology Company

USA . 659 parts In-Stock

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$20.444

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659

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$20.444

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Overview

Unlock the power of cutting-edge technology with the FW427IPMR-ACTA microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers unmatched quality and reliability. Perfect for a wide range of applications, this microcontroller offers customers exceptional value with its advanced features and high-performance capabilities. Experience seamless operation and innovative solutions with the FW427IPMR-ACTA, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable and rugged applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of input sources.

CPU Family: MSP430

Being part of the MSP430 CPU family ensures high performance, low power consumption, and a wide range of peripheral options for versatile applications.

ROM Words: 32768

With a large ROM capacity of 32768 words, the microcontroller can store complex programs and data, enabling advanced functionalities.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels allows the microcontroller to interface with analog sensors and signals, expanding its application capabilities.

Maximum Clock Frequency: 8 MHz

The high maximum clock frequency of 8 MHz enables fast processing speeds and real-time operations, suitable for time-sensitive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Reduced Instruction Set Computing (RISC) microcontroller with various built-in peripherals enhances efficiency, performance, and ease of integration in embedded systems.

RAM Bytes: 1024

A generous RAM capacity of 1024 bytes provides ample space for storing temporary data and variables during program execution, improving overall system performance.

Technical Specifications

Microcontrollers FW427IPMR-ACTA attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

BOD, COMPARATOR, LCD, TIMER(3), WDT

Trade Compliance

FW427IPMR-ACTA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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