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F280039SPZ

Texas Instruments

F280039SPZ by Texas Instruments

F280039SPZ by Texas Instruments is a 32-bit microcontroller with 23-Ch 12-Bit ADC, 2-Ch 12-Bit DAC, and 3 timers. It operates at speeds up to 25 MHz and has low power mode. Ideal for applications requiring high-speed data processing and precise analog-to-digital conversion in compact designs.

Median Price

$5.759

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,978 parts In-Stock

1+ parts

$5.759

100+ parts

$4.695

1k+ parts

$3.130

10k+ parts

-

2,978

$5.759

$4.695

$3.130

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,153 parts In-Stock

1+ parts

$5.471

100+ parts

-

1k+ parts

-

10k+ parts

-

1,153

$5.471

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-

-

Vyrian

USA . 8,654 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,654

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 2,038 parts In-Stock

1+ parts

$3.245

100+ parts

-

1k+ parts

-

10k+ parts

-

2,038

$3.245

-

-

-

Ampacity Inc.

Singapore . 1,296 parts In-Stock

1+ parts

$4.900

100+ parts

-

1k+ parts

-

10k+ parts

-

1,296

$4.900

-

-

-

Semicontronic

India . 1,268 parts In-Stock

1+ parts

$4.900

100+ parts

$4.778

1k+ parts

$4.753

10k+ parts

-

1,268

$4.900

$4.778

$4.753

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Corphita

USA . 2,858 parts In-Stock

1+ parts

$5.183

100+ parts

-

1k+ parts

-

10k+ parts

-

2,858

$5.183

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-

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Corohmni

South Africa . 124 parts In-Stock

1+ parts

$5.759

100+ parts

-

1k+ parts

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10k+ parts

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124

$5.759

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Microchip USA

USA . 1,250 parts In-Stock

1+ parts

$16.130

100+ parts

$15.890

1k+ parts

$15.780

10k+ parts

$15.660

1,250

$16.130

$15.890

$15.780

$15.660

Native Components

USA . 563 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.862

10k+ parts

-

563

-

-

$2.862

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Overview

Experience unmatched performance and reliability with the F280039SPZ microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge technology that exceeds expectations. This versatile device is perfect for a wide range of applications, offering seamless integration and outstanding efficiency. Explore the endless possibilities this product brings, providing exceptional value, benefits, and advantages to meet all your needs. Upgrade your projects with the F280039SPZ and unleash its full potential today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material which is ideal for electronic components.

Maximum Supply Voltage: 1.32 V

Allows for a higher supply voltage which can result in better performance.

ADC Channels: YES

Analog to Digital Converters enable the microcontroller to read and process analog signals, increasing its versatility.

Maximum Clock Frequency: 25 MHz

Higher clock frequency allows for faster processing speeds and overall better performance.

RAM Bytes: 70656

Large RAM capacity provides ample space for data storage and processing, making the microcontroller suitable for complex tasks.

Connectivity: CAN(2), FSI, I2C(2), LIN(2), SCI(2), SPI(2)

Multiple connectivity options make it compatible with a wide range of devices and systems, enhancing its versatility.

Technical Specifications

Microcontrollers F280039SPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of I/O Lines:

51

No. of Serial I/Os:

7

No. of Terminals:

100

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

70656

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

108 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), FSI, I2C(2), LIN(2), SCI(2), SPI(2)

Peripherals:

BOR, COMPARATOR(4), DMA(6), POR, PWM(16), TIMER(3), WDT(2)

Analog To Digital Convertors:

23-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

F280039SPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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