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F280039CSPNR

Texas Instruments

F280039CSPNR by Texas Instruments

The Texas Instruments F280039CSPNR microcontroller features 32-bit architecture, 80 terminals, and 196608 ROM words. Ideal for applications requiring CAN, I2C, and SPI connectivity with low power mode support. Operating temperature range from -40 to 125 °C.

Median Price

$8.658

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,370 parts In-Stock

1+ parts

$6.127

100+ parts

$4.995

1k+ parts

$3.330

10k+ parts

-

2,370

$6.127

$4.995

$3.330

-

Mouser Electronics

USA . 189 parts In-Stock

1+ parts

$11.190

100+ parts

$7.210

1k+ parts

$5.830

10k+ parts

-

189

$11.190

$7.210

$5.830

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,436 parts In-Stock

1+ parts

$5.821

100+ parts

-

1k+ parts

-

10k+ parts

-

1,436

$5.821

-

-

-

Vyrian

USA . 3,383 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,383

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 946 parts In-Stock

1+ parts

$1.495

100+ parts

-

1k+ parts

-

10k+ parts

-

946

$1.495

-

-

-

Northwest PG Solutions

USA . 1,532 parts In-Stock

1+ parts

$1.645

100+ parts

-

1k+ parts

-

10k+ parts

-

1,532

$1.645

-

-

-

Ampacity Inc.

Singapore . 1,146 parts In-Stock

1+ parts

$5.210

100+ parts

-

1k+ parts

-

10k+ parts

-

1,146

$5.210

-

-

-

Semicontronic

India . 956 parts In-Stock

1+ parts

$5.210

100+ parts

$5.080

1k+ parts

$5.054

10k+ parts

-

956

$5.210

$5.080

$5.054

-

Corphita

USA . 2,449 parts In-Stock

1+ parts

$5.514

100+ parts

-

1k+ parts

-

10k+ parts

-

2,449

$5.514

-

-

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Corohmni

South Africa . 414 parts In-Stock

1+ parts

$6.127

100+ parts

-

1k+ parts

-

10k+ parts

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414

$6.127

-

-

-

Microchip USA

USA . 3,179 parts In-Stock

1+ parts

$25.540

100+ parts

$25.380

1k+ parts

$25.310

10k+ parts

$25.230

3,179

$25.540

$25.380

$25.310

$25.230

Overview

Unleash the power of cutting-edge technology with the F280039CSPNR by Texas Instruments. This microcontroller is crafted with precision and excellence, offering unmatched quality and reliability for a wide range of applications. With advanced features like multiple ADC channels, DMA capabilities, and extensive peripherals, this product delivers unparalleled performance and efficiency. Elevate your projects to new heights with the superior value and benefits that this microcontroller brings, setting you apart from the competition. Experience innovation like never before with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the microcontroller, ensuring longevity and reliability.

Maximum Supply Voltage: 1.32 V

With a maximum supply voltage of 1.32 V, this microcontroller is suitable for low power applications and offers efficient power consumption.

No. of Terminals: 80

The high number of terminals allows for versatile connectivity options, making it suitable for complex systems and applications.

ADC Channels: YES

The presence of Analog to Digital Convertor channels enables the microcontroller to interface with analog sensors and signals, expanding its application range.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance and efficiency in processing complex instructions, making it suitable for demanding applications.

Speed: 120 rpm

The high speed capability of 120 rpm allows for fast processing of data and commands, enhancing the overall performance of the microcontroller.

Technical Specifications

Microcontrollers F280039CSPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of I/O Lines:

39

No. of Serial I/Os:

7

No. of Terminals:

80

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

70656

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

108 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), FSI, I2C(2), LIN(2), SCI(2), SPI(2)

Peripherals:

BOR, COMPARATOR(4), DMA(6), POR, PWM(16), TIMER(3), WDT(2)

Analog To Digital Convertors:

18-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

F280039CSPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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