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F280033SPZ

Texas Instruments

F280033SPZ by Texas Instruments

The Texas Instruments F280033SPZ microcontroller features a 32-bit CPU, 23-Ch 12-Bit ADC, and 2-Ch 12-Bit DAC. Ideal for applications requiring high-speed processing, precision analog-to-digital conversion, and multiple PWM channels. With low power mode and extensive connectivity options including CAN, I2C, LIN, SCI, and SPI interfaces.

Median Price

$6.794

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,040 parts In-Stock

1+ parts

$4.379

100+ parts

$3.570

1k+ parts

$2.380

10k+ parts

-

1,040

$4.379

$3.570

$2.380

-

Mouser Electronics

USA . 900 parts In-Stock

1+ parts

$9.210

100+ parts

$5.320

1k+ parts

$4.630

10k+ parts

$4.180

900

$9.210

$5.320

$4.630

$4.180

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,876 parts In-Stock

1+ parts

$4.160

100+ parts

-

1k+ parts

-

10k+ parts

-

1,876

$4.160

-

-

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Vyrian

USA . 3,046 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,046

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 495 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

-

495

$2.000

-

-

-

Northwest PG Solutions

USA . 1,570 parts In-Stock

1+ parts

$2.199

100+ parts

-

1k+ parts

-

10k+ parts

-

1,570

$2.199

-

-

-

Semicontronic

India . 936 parts In-Stock

1+ parts

$3.720

100+ parts

$3.627

1k+ parts

$3.608

10k+ parts

-

936

$3.720

$3.627

$3.608

-

Ampacity Inc.

Singapore . 932 parts In-Stock

1+ parts

$3.720

100+ parts

-

1k+ parts

-

10k+ parts

-

932

$3.720

-

-

-

Corphita

USA . 4,029 parts In-Stock

1+ parts

$3.941

100+ parts

-

1k+ parts

-

10k+ parts

-

4,029

$3.941

-

-

-

Corohmni

South Africa . 430 parts In-Stock

1+ parts

$4.379

100+ parts

-

1k+ parts

-

10k+ parts

-

430

$4.379

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-

-

Overview

Experience unparalleled performance and reliability with the F280033SPZ microcontroller by Texas Instruments. Crafted with precision using high-quality materials, this microcontroller offers a wide range of applications in various industries. From its advanced features like multiple ADC channels to its low power mode, this product delivers exceptional value to customers looking for cutting-edge technology. Trust in Texas Instruments' reputation for excellence and choose the F280033SPZ for all your microcontroller needs. Elevate your projects with the best in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the microcontroller, ensuring longevity and reliability.

Maximum Supply Voltage: 1.32 V

Allows for a wide range of voltage inputs, making the microcontroller versatile in different power supply situations.

Bit Size: 32

High bit size allows for complex data processing and calculations, suitable for a variety of applications.

No. of Terminals: 100

Large number of terminals provide flexibility in connectivity options for various peripherals and components.

ADC Channels: YES

Built-in analog to digital converters allow for easy interfacing with analog sensors, expanding the range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances performance by simplifying instruction set and improving processing speed.

Connectivity: CAN(2), FSI, I2C(2), LIN(2), SCI(2), SPI(2)

Multiple communication interfaces enable seamless connection to various devices and systems, enhancing compatibility.

Speed: 120 rpm

Fast processing speed allows for efficient execution of instructions, ideal for real-time applications.

Technical Specifications

Microcontrollers F280033SPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of I/O Lines:

51

No. of Serial I/Os:

7

No. of Terminals:

100

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

70656

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

108 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), FSI, I2C(2), LIN(2), SCI(2), SPI(2)

Peripherals:

BOR, COMPARATOR(4), DMA(6), POR, PWM(16), TIMER(3), WDT(2)

Analog To Digital Convertors:

23-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

F280033SPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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