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EZ430-RF2500-SEH

Texas Instruments

EZ430-RF2500-SEH by Texas Instruments

EZ430-RF2500-SEH by Texas Instruments is a solar energy harvesting board operating at 2.4GHz frequency, designed for use with MSP430. It comes in a box package and includes RF evaluation capabilities, making it ideal for development projects requiring wireless communication.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,706 parts In-Stock

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Digiode

USA . 3,554 parts In-Stock

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Euro-Tech

UK . 1 parts In-Stock

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Native Components

USA . 512 parts In-Stock

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$5.438

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512

$5.438

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AZTECH Wire

Italy . 202 parts In-Stock

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$10.692

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202

$10.692

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One Stop Electronics

USA . 942 parts In-Stock

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$47.100

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942

$47.100

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ChromeModa Solutions

Germany . 2,252 parts In-Stock

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Parana Technologies

USA . 2,061 parts In-Stock

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$0.072

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2,061

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$0.072

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Northwest PG Solutions

USA . 1,671 parts In-Stock

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$5.330

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Corphita

USA . 1,434 parts In-Stock

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IDEA Electronic Components Group

UK . 658 parts In-Stock

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DigiPath Technology Company

USA . 248 parts In-Stock

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Overview

Upgrade your development projects with the EZ430-RF2500-SEH from Texas Instruments, a top-tier manufacturer known for high-quality products. This solar energy harvesting board offers endless possibilities for RF evaluation and development, making it an essential tool for any tech enthusiast or professional. With its seamless integration with MSP430 and easy-to-use design, this kit is perfect for those looking to streamline their projects and elevate their work to the next level. Don't miss out on the value and benefits this product can bring to your work - get yours today!

Feature Benefit Bullets

Other Names: EZ430RF2500SEH, 296-24121

Having multiple names makes it easier to find information and order replacement parts for this product.

Category: Development Boards, Kits, Programmers, Evaluation Boards, RF Evaluation and Development Kits, Boards

This product falls into multiple categories, indicating its versatility and compatibility with various projects and applications.

Package: Box

The product comes in a sturdy box packaging, ensuring safe transportation and storage.

Type: Solar Energy Harvesting

Utilizing solar energy harvesting technology, this product promotes sustainability and energy efficiency.

Frequency: 2.4GHz

Operating at 2.4GHz frequency, this product offers reliable and stable wireless communication.

For Use With/Related Products: MSP430

Compatible with MSP430 products, this board ensures seamless integration and functionality with related components.

Supplied Contents: Board(s)

The product includes necessary board(s) for immediate use, saving time and effort in sourcing additional components.

Base Product Number: EZ430

Being part of the EZ430 product line, this item is known for its quality and reliability within the industry.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

With an MSL of 1, this product can be stored and used in various environments without concerns about moisture damage.

Technical Specifications

Additional Parts EZ430-RF2500-SEH attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

EZ430RF2500SEH
296-24121
EZ430-RF2500-SHE

Type:

Solar Energy Harvesting

Category:

Development Boards, Kits, Programmers
Evaluation Boards RF Evaluation and Development Kits, Boards

For Use With/Related Products:

MSP430

Supplied Contents:

Board(s)

Frequency:

2.4GHz

Package:

Box

Standard Package:

1

Base Product Number:

EZ430

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

EZ430-RF2500-SEH Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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