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DSLVDS1002DBVR

Texas Instruments

DSLVDS1002DBVR by Texas Instruments

DSLVD1002DBVR by Texas Instruments is a Line Receiver IC with 3.3V nominal voltage, EIA-644-A interface standard, and 3.5ns max receive delay. It is designed for industrial applications requiring differential Schmitt trigger input characteristics in a small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,326 parts In-Stock

1+ parts

-

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3,326

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Digiode

USA . 1,178 parts In-Stock

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1,178

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Distributors (Availability)

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Native Components

USA . 968 parts In-Stock

1+ parts

$0.494

100+ parts

-

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968

$0.494

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Northwest PG Solutions

USA . 1,804 parts In-Stock

1+ parts

$0.544

100+ parts

-

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$0.480

1,804

$0.544

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-

$0.480

AZTECH Wire

Italy . 645 parts In-Stock

1+ parts

$6.377

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645

$6.377

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Parana Technologies

USA . 87 parts In-Stock

1+ parts

$9.673

100+ parts

$898.323

1k+ parts

$8.706

10k+ parts

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87

$9.673

$898.323

$8.706

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DigiPath Technology Company

USA . 221 parts In-Stock

1+ parts

$10.652

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221

$10.652

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ChromeModa Solutions

Germany . 5,526 parts In-Stock

1+ parts

$10.869

100+ parts

$8.913

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5,526

$10.869

$8.913

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IDEA Electronic Components Group

UK . 847 parts In-Stock

1+ parts

$10.869

100+ parts

$10.326

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$9.782

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847

$10.869

$10.326

$9.782

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One Stop Electronics

USA . 1,050 parts In-Stock

1+ parts

$43.500

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1,050

$43.500

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Corphita

USA . 604 parts In-Stock

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604

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Overview

Enhance your electronic designs with the Texas Instruments DSLVDS1002DBVR Line Driver & Receiver. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge solutions for a wide range of applications. The DSLVDS1002DBVR offers customers unparalleled value, providing seamless communication and superior performance. With its compact design and industrial-grade temperature tolerance, this product ensures optimal functionality and efficiency. Experience the advantages of Texas Instruments technology and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making the product suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage ensures compatibility with a wide range of systems and power sources.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into existing circuit designs and placement on the PCB.

No. of Terminals: 5

Having a sufficient number of terminals provides flexibility in connecting the device to other components in the system.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable performance in harsh environmental conditions and extreme temperatures.

Terminal Finish: MATTE TIN

Matte Tin terminal finish offers good solderability and corrosion resistance, ensuring a reliable electrical connection.

Interface Standard: EIA-644-A; TIA-644-A

Compliance with industry standards ensures compatibility and interoperability with other devices in the network.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and reliability in the operation of the line driver/receiver.

Technical Specifications

Line Drivers & Receivers DSLVDS1002DBVR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-644-A; TIA-644-A

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Receive Delay:

3.5 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.45 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

DSLVDS1002DBVR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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