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DS90UH949TRGCTQ1

Texas Instruments

DS90UH949TRGCTQ1 by Texas Instruments

DS90UH949TRGCTQ1 by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at -40 to 105 °C. It has a supply voltage range of 1.045-1.155 V and supports I2C interface standard. Ideal for industrial applications requiring differential output characteristics in a compact chip carrier package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,142 parts In-Stock

1+ parts

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3,142

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Vyrian

USA . 1,358 parts In-Stock

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1,358

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,090 parts In-Stock

1+ parts

$8.680

100+ parts

-

1k+ parts

$9.361

10k+ parts

-

1,090

$8.680

-

$9.361

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ChromeModa Solutions

Germany . 791 parts In-Stock

1+ parts

$9.753

100+ parts

$7.997

1k+ parts

-

10k+ parts

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791

$9.753

$7.997

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IDEA Electronic Components Group

UK . 589 parts In-Stock

1+ parts

$9.753

100+ parts

$9.265

1k+ parts

$8.778

10k+ parts

-

589

$9.753

$9.265

$8.778

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AZTECH Wire

Italy . 422 parts In-Stock

1+ parts

$14.782

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422

$14.782

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One Stop Electronics

USA . 542 parts In-Stock

1+ parts

$40.500

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542

$40.500

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Ampacity Inc.

Singapore . 1,528 parts In-Stock

1+ parts

$49.500

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1,528

$49.500

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Continental Prestige Electronics

USA . 5,910 parts In-Stock

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5,910

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Lixinc

USA . 4,262 parts In-Stock

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4,262

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Argo Parts USA

USA . 3,032 parts In-Stock

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3,032

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Corphita

USA . 2,933 parts In-Stock

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2,933

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DigiPath Technology Company

USA . 1,853 parts In-Stock

1+ parts

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$8.793

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1,853

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$8.793

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Microchip USA

USA . 981 parts In-Stock

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981

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Overview

Enhance your electronic systems with the DS90UH949TRGCTQ1 by Texas Instruments, a top-tier manufacturer known for its industry-leading quality. As part of the Line Drivers & Receivers category, this product offers unparalleled reliability and performance. With applications in various industries, this chip carrier with a very thin profile delivers differential output and complementary polarity, making it ideal for demanding industrial environments. Trust Texas Instruments to provide cutting-edge technology that meets your needs, ensuring seamless operation and peace of mind. Upgrade your systems today with the DS90UH949TRGCTQ1 and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the package, ensuring long-term performance of the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly on circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.155 V

High maximum supply voltage allows for flexibility in power supply options, making it suitable for a variety of applications.

No. of Functions: 2

Having multiple functions in a single component reduces the need for additional components, saving space and cost in designs.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making it suitable for automotive and other demanding applications.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy placement on circuit boards.

Power Supplies (V): 1.1, 1.8

Multiple power supply options provide flexibility in voltage requirements, accommodating various system configurations.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish ensures reliable electrical connections and corrosion resistance for long-term performance.

Maximum Operating Temperature: 105 °C

High maximum operating temperature allows for use in harsh environments and ensures stable performance under varying temperature conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables reliable operation in both extreme cold and hot conditions, making it suitable for a variety of applications.

Technical Specifications

Line Drivers & Receivers DS90UH949TRGCTQ1 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO REQ 1.71 TO 1.89V AND 3.135 TO 3.465V

Differential Output:

YES

Driver No. of Bits:

2

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

I2C

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

DIFFERENTIAL

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

330 mA

Maximum Supply Voltage:

1.155 V

Minimum Supply Voltage:

1.045 V

Nominal Supply Voltage:

1.1 V

Maximum Supply Voltage-1:

1.155 V

Minimum Supply Voltage-1:

1.045 V

Nominal Supply Voltage-1:

1.1 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

DS90UH949TRGCTQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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