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DS90UH947NTRGCRQ1

Texas Instruments

DS90UH947NTRGCRQ1 by Texas Instruments

DS90UH947NTRGCRQ1 by Texas Instruments is a Line Driver with 2 functions, operating at -40 to 105 °C. It features differential output, complementary polarity, and nickel palladium gold finish. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,556 parts In-Stock

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Vyrian

USA . 2,760 parts In-Stock

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2,760

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Nova Conductors

Japan . 50 parts In-Stock

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50

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One Stop Electronics

USA . 915 parts In-Stock

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$3.500

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915

$3.500

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AZTECH Wire

Italy . 786 parts In-Stock

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$5.071

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786

$5.071

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Parana Technologies

USA . 2,298 parts In-Stock

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$11.068

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$11.528

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$11.068

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$11.528

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DigiPath Technology Company

USA . 833 parts In-Stock

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$12.187

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833

$12.187

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ChromeModa Solutions

Germany . 5,410 parts In-Stock

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$12.436

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$10.198

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$12.436

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IDEA Electronic Components Group

UK . 2,324 parts In-Stock

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$12.436

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$11.814

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$11.192

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2,324

$12.436

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$11.192

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Microchip USA

USA . 1,974 parts In-Stock

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Corphita

USA . 1,400 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the DS90UH947NTRGCRQ1 by Texas Instruments. Designed with precision and reliability in mind, this line driver & receiver boasts top-quality materials and advanced features that set it apart from the rest. From automotive to industrial applications, this versatile product delivers seamless performance and unmatched efficiency. Experience the value and benefits of Texas Instruments' expertise with the DS90UH947NTRGCRQ1 - your key to staying ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring the longevity of the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.155 V

Operates effectively within a safe voltage range, preventing damage to the device.

No. of Functions: 2

Offers multiple functions in a single device, potentially reducing the need for additional components.

Screening Level: AEC-Q100

Meets automotive industry standards for quality and reliability, making it suitable for automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable performance over time.

Maximum Operating Temperature: 105 °C

Capable of operating in high temperature environments, making it suitable for industrial applications.

Output Characteristics: DIFFERENTIAL

Delivers differential signals for improved noise immunity and signal integrity in data transmission.

Minimum Operating Temperature: -40 °C

Can function in low temperature conditions, expanding its usability in various environments.

Maximum Supply Current: 469 mA

Supports a high supply current, enabling the device to power multiple components or circuits.

Technical Specifications

Line Drivers & Receivers DS90UH947NTRGCRQ1 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Interface IC Type:

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.9 V

Output Characteristics:

DIFFERENTIAL

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

469 mA

Maximum Supply Voltage:

1.155 V

Minimum Supply Voltage:

1.045 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

DS90UH947NTRGCRQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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