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DS90UH940TNKDRQ1

Texas Instruments

DS90UH940TNKDRQ1 by Texas Instruments

DS90UH940TNKDRQ1 by Texas Instruments is a Line Driver with 2 functions, operating at -40 to 105 °C. It has a supply voltage range of 1.71V to 3.6V and comes in a square package style suitable for industrial applications requiring differential Schmitt trigger input characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,962 parts In-Stock

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Chip Stock

USA . 5,170 parts In-Stock

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Digiode

USA . 1,551 parts In-Stock

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Native Components

USA . 253 parts In-Stock

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$1.056

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Northwest PG Solutions

USA . 476 parts In-Stock

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$1.161

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One Stop Electronics

USA . 388 parts In-Stock

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$1.500

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Parana Technologies

USA . 1,982 parts In-Stock

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$5.349

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$6.017

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DigiPath Technology Company

USA . 2,225 parts In-Stock

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$5.890

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$5.419

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ChromeModa Solutions

Germany . 4,171 parts In-Stock

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$6.010

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$4.928

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IDEA Electronic Components Group

UK . 1,285 parts In-Stock

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$5.409

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AZTECH Wire

Italy . 870 parts In-Stock

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Lixinc

USA . 9,795 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,869 parts In-Stock

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Corphita

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Infinite Electronics LLP (Excess)

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Kepictronics

USA . 2,476 parts In-Stock

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Microchip USA

USA . 1,853 parts In-Stock

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Overview

Enhance your electronic designs with the DS90UH940TNKDRQ1 by Texas Instruments, a high-quality line driver and receiver that offers unmatched performance and reliability. Manufactured by the reputable company Texas Instruments, this product is ideal for a wide range of applications in automotive, industrial, and communication systems. With a focus on value and innovation, customers can expect seamless integration, improved signal integrity, and enhanced functionality. Experience the benefits of advanced technology with the DS90UH940TNKDRQ1 and take your projects to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of systems and power sources, providing flexibility in application.

No. of Functions: 2

Having multiple functions in one component reduces the need for additional parts and simplifies circuit design.

Package Shape: SQUARE

The square package shape helps in easy handling and alignment during assembly on circuit boards.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can withstand demanding industrial environments and extended usage.

Minimum Operating Temperature: -40 °C

The wide range of operating temperature ensures reliable performance in extreme cold conditions.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is a common standard in many electronic systems, providing compatibility and ease of integration.

Technical Specifications

Line Drivers & Receivers DS90UH940TNKDRQ1 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Receiver No. of Bits:

2

Screening Level:

AEC-Q100

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

1.89 V

Minimum Supply Voltage-1:

1.71 V

Nominal Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

DS90UH940TNKDRQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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