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DS90UH929TRGCTQ1

Texas Instruments

DS90UH929TRGCTQ1 by Texas Instruments

DS90UH929TRGCTQ1 by Texas Instruments is an AEC-Q100 compliant LINE DRIVER with 64 terminals. It operates at -40 to 105 °C, with a supply voltage range of 1.71-1.89 V. Ideal for industrial applications requiring differential outputs and complementary polarity control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,981 parts In-Stock

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7,981

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Digiode

USA . 2,833 parts In-Stock

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2,833

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Parana Technologies

USA . 2,371 parts In-Stock

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$7.844

100+ parts

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$8.400

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2,371

$7.844

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$8.400

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ChromeModa Solutions

Germany . 1,044 parts In-Stock

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$8.814

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$7.227

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$8.814

$7.227

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IDEA Electronic Components Group

UK . 86 parts In-Stock

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$8.814

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$8.373

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$7.933

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86

$8.814

$8.373

$7.933

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AZTECH Wire

Italy . 224 parts In-Stock

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$13.325

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224

$13.325

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One Stop Electronics

USA . 700 parts In-Stock

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$13.500

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700

$13.500

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Northwest PG Solutions

USA . 2,034 parts In-Stock

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DigiPath Technology Company

USA . 1,255 parts In-Stock

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$7.947

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$7.947

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Microchip USA

USA . 913 parts In-Stock

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Native Components

USA . 866 parts In-Stock

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Corphita

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Overview

Experience the superior quality and reliability of Texas Instruments with the DS90UH929TRGCTQ1 Line Driver & Receiver. Designed for industrial applications, this product offers a wide operating temperature range and AEC-Q100 screening level for peace of mind. With a compact chip carrier package style and versatile terminal finish, this device provides differential output and complementary output polarity for seamless integration. Trust Texas Instruments to deliver innovative solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the product, ensuring a longer lifespan and reliable performance.

Surface Mount: YES

Being surface mountable allows for easy and convenient integration into circuit board designs, saving space and making assembly more efficient.

Package Shape: SQUARE

The square package shape helps in efficient utilization of board space, making it suitable for compact applications.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and extended operation without compromising performance.

Differential Output: YES

The differential output enhances noise immunity and signal integrity, making it ideal for applications where data accuracy and reliability are crucial.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in a wide range of temperature environments, making it suitable for industrial applications.

Technical Specifications

Line Drivers & Receivers DS90UH929TRGCTQ1 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Interface IC Type:

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.197 V

Output Characteristics:

DIFFERENTIAL

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

330 mA

Maximum Supply Voltage-1:

1.89 V

Minimum Supply Voltage-1:

1.71 V

Nominal Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

DS90UH929TRGCTQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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