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DS90UH928QSQ/NOPB

Texas Instruments

DS90UH928QSQ/NOPB by Texas Instruments

DS90UH928QSQ/NOPB by Texas Instruments is a Line Driver with 3.6V max supply voltage, -40 to 105°C operating temperature range, and 250mA max supply current. It is used in industrial applications requiring high-speed data transmission over short distances.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,999 parts In-Stock

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6,999

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Digiode

USA . 1,847 parts In-Stock

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1,847

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Distributors (Availability)

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Native Components

USA . 620 parts In-Stock

1+ parts

$1.090

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620

$1.090

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Northwest PG Solutions

USA . 143 parts In-Stock

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$1.199

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143

$1.199

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Parana Technologies

USA . 801 parts In-Stock

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$2.551

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$3.037

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801

$2.551

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$3.037

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ChromeModa Solutions

Germany . 6,080 parts In-Stock

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$2.866

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$2.350

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6,080

$2.866

$2.350

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IDEA Electronic Components Group

UK . 617 parts In-Stock

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$2.866

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$2.579

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617

$2.866

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$2.579

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AZTECH Wire

Italy . 552 parts In-Stock

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$11.044

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$11.044

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One Stop Electronics

USA . 747 parts In-Stock

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$30.500

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GreenTree Electronics

Israel . 9,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,561 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,707 parts In-Stock

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Microchip USA

USA . 1,803 parts In-Stock

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Corphita

USA . 1,658 parts In-Stock

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DigiPath Technology Company

USA . 374 parts In-Stock

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$2.584

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374

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$2.584

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Overview

Enhance your electronic designs with the DS90UH928QSQ/NOPB from Texas Instruments, a leading manufacturer known for its high-quality components. As a Line Driver & Receiver, this versatile chip provides reliable signal transmission in various applications. Offering a wide temperature range and low power consumption, this product ensures optimal performance even in challenging conditions. Trust Texas Instruments to deliver superior products that meet your needs and exceed your expectations. Upgrade your systems with the DS90UH928QSQ/NOPB and experience enhanced efficiency and reliability like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important considerations.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving both time and costs during manufacturing.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality, making the product suitable for automotive applications where robustness is crucial.

Maximum Supply Voltage-1: 3.6 V

The high maximum supply voltage allows for flexibility in power supply design, accommodating a wide range of voltage requirements.

Minimum Supply Voltage-1: 3 V

The low minimum supply voltage ensures energy efficiency and compatibility with various power sources, making the product versatile in different operating conditions.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range enables the product to function reliably in extreme temperature conditions, increasing its overall durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to operate effectively in cold environments without compromising performance, enhancing its versatility.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and conductivity, ensuring secure connections and reliable performance.

Terminal Position: QUAD

Quad terminal position enables easy integration into circuit designs, offering greater flexibility and options for connection configurations.

Maximum Supply Current: 250 mA

The high maximum supply current capability allows the product to deliver sufficient power to connected devices, making it suitable for high-demand applications.

Technical Specifications

Line Drivers & Receivers DS90UH928QSQ/NOPB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

1

Screening Level:

AEC-Q100

Maximum Seated Height:

.8 mm

Maximum Supply Current:

250 mA

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

DS90UH928QSQ/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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