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DS90UH927QSQ/NOPB

Texas Instruments

DS90UH927QSQ/NOPB by Texas Instruments

DS90UH927QSQ/NOPB by Texas Instruments is a Line Driver with 3.3V power supply, operating temperature range of -40 to 105 °C. It has 40 terminals in a square package style suitable for industrial applications requiring high-speed data transmission.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,777 parts In-Stock

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5,777

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Digiode

USA . 1,507 parts In-Stock

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1,507

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Distributors (Availability)

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Parana Technologies

USA . 1,101 parts In-Stock

1+ parts

$2.879

100+ parts

-

1k+ parts

$3.371

10k+ parts

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1,101

$2.879

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$3.371

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DigiPath Technology Company

USA . 1,033 parts In-Stock

1+ parts

$3.170

100+ parts

$2.917

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-

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1,033

$3.170

$2.917

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ChromeModa Solutions

Germany . 4,401 parts In-Stock

1+ parts

$3.235

100+ parts

$2.653

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4,401

$3.235

$2.653

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IDEA Electronic Components Group

UK . 1,116 parts In-Stock

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$3.235

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$2.912

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1,116

$3.235

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$2.912

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Native Components

USA . 739 parts In-Stock

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$18.155

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739

$18.155

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AZTECH Wire

Italy . 868 parts In-Stock

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$19.411

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868

$19.411

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Northwest PG Solutions

USA . 2,130 parts In-Stock

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$19.970

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$17.973

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2,130

$19.970

$17.973

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One Stop Electronics

USA . 1,375 parts In-Stock

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$47.500

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1,375

$47.500

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A-Z Elektronik GmbH

Germany . 5,616 parts In-Stock

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5,616

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Alle Elektronik GmbH

Germany . 3,744 parts In-Stock

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Corphita

USA . 2,811 parts In-Stock

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Microchip USA

USA . 953 parts In-Stock

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Overview

Unlock seamless data transmission and enhanced signal integrity with the DS90UH927QSQ/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality line drivers & receivers like no other. Ideal for a wide range of applications, this product offers unmatched value and benefits to customers. Experience reliable performance and efficient power management with this cutting-edge solution. Choose Texas Instruments for superior technology that meets your needs.

Feature Benefit Bullets

Package Body Material: Plastic/Epoxy

Provides durability and protection for the internal components of the line driver/receiver, ensuring long-lasting performance.

Surface Mount: Yes

Allows for easy installation on circuit boards, saving space and facilitating efficient assembly.

Maximum Supply Voltage: 3.6 V

Can handle higher voltages, making it suitable for a wide range of applications.

Minimum Supply Voltage: 3 V

Operates effectively even at low supply voltages, ensuring reliable performance in various conditions.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, making it suitable for industrial environments where heat may be a factor.

Minimum Operating Temperature: -40 °C

Operates effectively in low temperatures, ensuring reliable performance in cold environments.

Terminal Finish: Matte Tin

Provides a reliable and durable finish for the terminals, ensuring good electrical conductivity.

Maximum Supply Current: 160 mA

Can handle high supply currents, making it suitable for applications that require a significant amount of power.

Interface IC Type: Line Driver

Specifically designed to amplify or strengthen signals along transmission lines, ensuring clear and consistent communication.

Technical Specifications

Line Drivers & Receivers DS90UH927QSQ/NOPB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

1

Interface IC Type:

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

.8 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

160 mA

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

DS90UH927QSQ/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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