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DS90UB947NTRGCRQ1

Texas Instruments

DS90UB947NTRGCRQ1 by Texas Instruments

DS90UB947NTRGCRQ1 by Texas Instruments is a 64-terminal line driver with differential output, operating at -40 to 105°C. It has a max supply voltage of 1.155V and can handle up to 469mA supply current. Ideal for industrial applications requiring high-speed data transmission in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,269 parts In-Stock

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Chip Stock

USA . 3,100 parts In-Stock

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Digiode

USA . 2,431 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Parana Technologies

USA . 1,527 parts In-Stock

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$2.229

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$2.733

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$2.229

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$2.733

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ChromeModa Solutions

Germany . 3,496 parts In-Stock

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$2.504

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$2.053

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IDEA Electronic Components Group

UK . 554 parts In-Stock

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$2.504

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$2.254

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One Stop Electronics

USA . 1,605 parts In-Stock

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$3.500

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$3.500

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Ampacity Inc.

Singapore . 784 parts In-Stock

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$12.500

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AZTECH Wire

Italy . 808 parts In-Stock

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$17.817

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QUARKTWIN TECHNOLOGY LTD

USA . 18,843 parts In-Stock

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Microchip USA

USA . 11,585 parts In-Stock

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Corphita

USA . 4,308 parts In-Stock

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Continental Prestige Electronics

USA . 3,455 parts In-Stock

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Argo Parts USA

USA . 3,042 parts In-Stock

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DigiPath Technology Company

USA . 2,323 parts In-Stock

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$2.258

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Overview

Experience unparalleled performance and reliability with the DS90UB947NTRGCRQ1 by Texas Instruments, a leading manufacturer in the industry. This innovative line driver offers superior quality and efficiency, making it ideal for a wide range of applications. Whether you're in automotive, industrial, or consumer electronics, this product provides unmatched value and benefits to customers. Trust Texas Instruments to deliver cutting-edge solutions that meet your needs and exceed your expectations. Elevate your projects with the DS90UB947NTRGCRQ1 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, perfect for various applications.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into electronic devices.

Maximum Supply Voltage: 1.155 V

Offers a high maximum supply voltage, providing flexibility in power supply options.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality, making it suitable for automotive applications.

No. of Terminals: 64

The ample number of terminals allows for versatile connectivity and compatibility with various systems.

Output Characteristics: DIFFERENTIAL

Differential output enables improved noise rejection and signal integrity, making it ideal for high-performance applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product can withstand harsh environmental conditions.

Maximum Supply Current: 469 mA

The high maximum supply current capability ensures stable and consistent performance under different load conditions.

Interface IC Type: LINE DRIVER

The line driver interface type enables efficient signal transmission over long distances, making it suitable for communication systems.

Technical Specifications

Line Drivers & Receivers DS90UB947NTRGCRQ1 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.63 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

4 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

469 mA

Maximum Supply Voltage:

1.155 V

Minimum Supply Voltage:

1.045 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

DS90UB947NTRGCRQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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